Engineer Aeronautical - Level 4 : Electronics Packaging - R10222485 jobs in United States
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Northrop Grumman · 18 hours ago

Engineer Aeronautical - Level 4 : Electronics Packaging - R10222485

Northrop Grumman is a leading aerospace and defense technology company seeking an Engineer Aeronautical - Level 4 in their Electronics Packaging group. The role involves mechanical design, analysis, and testing of avionics hardware for launch vehicle applications, along with providing technical leadership and support to junior engineers.

AerospaceBig DataManufacturingData IntegrationRemote SensingSecurity
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Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Responsible Engineer for the Mechanical design, analysis, and test of Avionics hardware for use in a launch vehicle application
CAD design
Design analysis
Test data review
Production engineering support
Environmental test support
Supplier engineering support
Test history matrix management
Provides technical leadership and reviews the work of junior engineers

Qualification

Mechanical designAvionics hardwareAdvanced CADElectronics Packaging analysisGD&T applicationEnvironmental testingManufacturing environmentTroubleshootingFailure analysisTeam leadershipMentoring

Required

Bachelor's degree in a STEM discipline (Science, Technology, Engineering or Math) with 8 years of related engineering experience; OR a Master's degree in STEM with 6 years of related engineering experience, or a PhD in STEM with 4 years of related engineering experience
Ability to obtain a US DoD Secret security clearance
Experience in analysis of bolted joints, dynamic/thermal environments, tolerance stack, basic avionics structures
Experience with the design of Electronic Assemblies
Advanced CAD experience (preferably Siemens NX)
Demonstrated application of GD&T through release of complex machined hardware drawings

Preferred

Active US DoD Secret security clearance, or higher
Experience witnessing or performing environmental testing (vibration/shock/thermal)
High level understanding of Electronics Packaging analysis like solder fatigue analysis (Steinberg / Engelmaier), keepout analysis, & finite element analysis of avionics structures
Experience working with quality management systems related to hardware production (nonconformances/discrepancy reporting etc)
Experience in a manufacturing environment
Experience with digital product definitions & Product and Manufacturing Information (PMI)
Ability to lead a small team and mentor less-experienced staff
Experience with mechanical and electrical troubleshooting and failure analysis

Benefits

Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO) for vacation and/or personal business

Company

Northrop Grumman

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Northrop Grumman is an aerospace, defense and security company that provides training and satellite ground network communications software.

Funding

Current Stage
Public Company
Total Funding
$3.7B
Key Investors
U.S. Department of DefenseNASA
2025-05-27Post Ipo Debt· $1B
2024-01-29Post Ipo Debt· $2.5B
2023-12-20Grant· $72M

Leadership Team

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Tom Wilson
Corporate Vice President, Enterprise Business Development
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Jeffrey Worsham
Chief Product Owner - Advanced Technology Development
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Company data provided by crunchbase