Advanced Package Design Engineer jobs in United States
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SK hynix America · 8 hours ago

Advanced Package Design Engineer

SK hynix America is at the forefront of semiconductor innovation, developing advanced memory solutions. They are seeking a skilled Advanced Package Design Engineer to design and optimize high-performance, high-density Interposers for chiplet-based architectures and collaborate with various teams to deliver manufacturable package solutions.

Semiconductors
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H1B Sponsor Likelynote

Responsibilities

Design silicon and organic interposers for advanced packaging solutions
Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design
Create and maintain layout design rules, stack-ups, and layout guidelines
Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

Qualification

Semiconductor package designEDA toolsHigh-speed signal routing2.5D/3D packaging technologiesSI/PI simulation toolsEffective communication

Required

Bachelor's or Master's degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field
3+ years of experience in semiconductor package design or layout
Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
Understanding of high-speed signal routing, power distribution networks (PDN)
Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
Effective communication skills and ability to work in a fast-paced, cross-functional environment

Preferred

Currently pursuing a PhD's degree in Electrical Engineering or a related field
5+ years of experiences in advanced packaging layout design
Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
Proven understanding of high-speed signal routing, power distribution networks (PDN)
Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

Benefits

Top Tier health insurance at no employee cost
Paid day offs: PTO + Company Holidays + Happy Fridays
Paid Parental Leave Program
401k Matching
Educational reimbursement up to $10,000 per year
Donation Matching and volunteering opportunities
Corporate discount programs
Free Breakfast/Lunch/Dinner provided to employees

Company

SK hynix America

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Semiconductors are essential to all IT products, and its performance often determines the performance of the final products.

H1B Sponsorship

SK hynix America has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (16)
2023 (3)
2022 (3)
2021 (2)
2020 (2)

Funding

Current Stage
Growth Stage

Leadership Team

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Jennifer Lee
Director of Technology / Evangelist : Pathfinding & Partnerships
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Company data provided by crunchbase