ElectroMechanical Packaging Engineer II jobs in United States
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Lockheed Martin · 1 day ago

ElectroMechanical Packaging Engineer II

Lockheed Martin is a leading technology innovation company that focuses on solving the world's most complex challenges. They are seeking a full-time Early Career Packaging Engineer to support the FBM program by designing avionics enclosures for electronic packages, developing interface control drawings, and coordinating with vendors.

National DefenseCyber SecurityAerospaceManufacturingMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
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Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Support FBM on the TMK2 program by designing Avionics enclosures for electronic packages
Develop interface control drawings
Coordinating with vendors

Qualification

Mechanical EngineeringAerospace EngineeringCAD ModelingCREOZukenMicrosoft OfficeGD&TTeam Collaboration

Required

Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline
CAD modeling and drafting experience or coursework (CREO, SolidWorks and/or similar CAD data modeling experience, model based engineering)
Willing and able to obtain and maintain a DoD Top-Secret clearance, thus US Citizenship is required

Preferred

Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint)
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines
Experience with CREO CAD modeling and Zuken

Benefits

Medical
Dental
Vision
Life Insurance
Short-Term Disability
Long-Term Disability
401(k) match
Flexible Spending Accounts
EAP
Education Assistance
Parental Leave
Paid time off
Holidays

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

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Jim Taiclet
Chairman, President & CEO
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Craig Martell
Chief Technology Officer
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Company data provided by crunchbase