Intel Corporation · 12 hours ago
Advanced Packaging Supplier Technology Development Program Manager
Phoenix, AZ
Full-time
Onsite
Mid, Senior Level
$134K/yr - $255K/yr
3+ years expIntel Corporation is seeking an Advanced Packaging Supplier Technology Development Program Manager to deliver supplier capacity expansion for advanced heterogeneous packaging technology. The role involves project management, technical risk assessment, and supplier management to ensure on-time delivery and qualification of new production capacity.
Semiconductors
Responsibilities
Scoping / Planning - HVM process flow finalization and process tool requirements definition with the TD team and the supplier. Tool selection and production line qualification planning so as to minimize ramp risk and meet certification requirements. Existing and, as necessary, new factory planning / layout to maximize yield and new capacity in the minimum time within budget. Update plans as necessary or as contingencies for customer / technical / volume requirements changes
CapEx Project Execution through Production Ramp - on-time execution of management-aligned capacity expansion plans through systematic processes. Create and drive yield-enabling/yield-improvement plans. Drive qualification activities and closely monitor ramp indicators to insure incident-free production ramp of new capacity. Anticipate and quickly resolve technical and logistical problems that would risk quality or on-time delivery of committed capacity. Development and maintenance of supplier milestone progress dashboards to focus resources and keep projects on-track
Capability Transfer - Where necessary, facilitate technical capability transfer from internal pilot manufacturing line to supplier capacity expansion line. Assess supplier knowledge gaps relative to technical and schedule requirements to create and drive gap closure / risk mitigation plans
Regular updates to management / stakeholders on progress and risk mitigation activities
Qualification
Required
PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering or relevant field and 3+ years of relevant experience
OR- Masters Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or relevant field and 5+ years of relevant experience
Demonstrated experience achieving integrated process, materials, chemistry, and/or tool hardware development and customer qualification milestones on-time
Experience managing cross-functional teams across multiple time zones and cultural contexts
Demonstrated skills to work well with teams of technical/commercial stakeholders across organizations to accomplish objectives on-time through work groups and, as necessary, task forces
Strong understanding of process building blocks (including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metro, electrical test, etc.) and critical process interactions
Strong knowledge of DOE, PCS, and SPC
Preferred
Experience qualifying / owning process tools in a TD and/or HVM context is highly desired
Supplier-/geography-relevant language skills a plus
Direct prior process qualification experience with semiconductor packaging suppliers is a plus
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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