Lam Research · 3 hours ago
Product Engineer 3
Lam Research is dedicated to excellence in the design and engineering of etch and deposition products for the semiconductor industry. The role involves integration, testing, and analysis of diverse sensor technologies, collaborating with engineering teams to develop robust infrastructure for data acquisition and processing.
CleanTechManufacturingSemiconductor
Responsibilities
Collaborate with cross-functional and cross-cultural teams to guide the specification and development of products
Debug optical, electrical, mechanical, and signal integrity issues during sensor module development
Perform comprehensive characterization of imaging sensors, time-series sensors (e.g., thermal, acoustic, vibration), and associated signal processing pipelines
Collaborate with cross-functional teams to identify, implement, and validate improvements in sensor data capture and processing across hardware and software
Apply engineering theories and research techniques to investigate, troubleshoot, and resolve technical challenges
Plan and execute research to advance sensor analytics, including image/video processing and time-series signal analysis for semiconductor equipment
Develop algorithms and workflows for sensor fusion, anomaly detection, and predictive modeling using multi-modal data
Assess effectiveness and accuracy of models and data acquisition techniques
Develop, train, and deploy models for optimizing customer experience and equipment reliability
Create test plans, documentation, and reports for sensor validation and performance metrics
Support process engineers by running recipes and coordinating sensor-based measurements on process modules
Maintain a high degree of customer engagement including face-to-face and international travel to customer sites supporting near term product releases and solve customer issues
Work in a cleanroom lab and/or customer semiconductor fab environment
Qualification
Required
BS/MS/PhD in Electrical Engineering, Computer Science, Mechanical Engineering, Physics, Applied Mathematics, or related disciplines
Strong experience in signal processing, sensor integration, and data analysis for imaging and non-imaging sensors
Proficiency in image processing, computer vision, and time-series analysis algorithms
Expertise in scripting languages such as Python or MATLAB; familiarity with scientific computing libraries
Knowledge of sensor calibration methods (e.g., camera calibration, sensor alignment) and data acquisition systems
Familiarity with software test methodologies, Design of Experiments, and performance validation
Strong problem-solving and troubleshooting skills across hardware and software domains
Ability to learn new technologies and complete projects with minimal guidance
Comfortable with multiple software tools and basic system/network troubleshooting
Preferred
Experience with Python and the scientific stack (NumPy, SciPy, Pandas, OpenCV)
Background in sensor fusion, anomaly detection, and predictive analytics
Working knowledge of network protocols and streaming data analytics
Experience with thermal imaging, spectroscopy, vibration/acoustic sensors, or other non-vision sensing modalities
Familiarity with semiconductor processing and equipment operations (Lam Research experience is a plus)
Exposure to machine learning techniques for image classification, segmentation, and time-series forecasting
Benefits
A variety of work location models based on the needs of each role
On-site Flex
Virtual Flex
A comprehensive set of outstanding benefits
Company
Lam Research
Lam Research supplies wafer fabrication equipment and services to the worldwide semiconductor industry.
H1B Sponsorship
Lam Research has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (239)
2023 (170)
2022 (216)
2021 (242)
2020 (182)
Funding
Current Stage
Public CompanyTotal Funding
unknown1984-05-11IPO
Recent News
2026-02-03
2026-02-02
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