nEye.ai · 3 months ago
Packaging Design Engineer - Optical Interfaces
Santa Clara, CA, US
Full-time
Onsite
Senior Level
5+ years expnEye.ai is seeking a highly skilled and experienced Packaging Design Engineer to lead the development of next-generation silicon photonics packaging solutions. The role involves owning the entire process from design to optimization, ensuring high performance and reliability in optical interfacing processes.
Advanced MaterialsNanotechnologySemiconductor
Responsibilities
Process Design & Development: (1) Design and develop robust, high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs), regardless of the underlying waveguide technology (e.g., Si, SiN, InP). (2) Specialize in using advanced methods to achieve stable and reliable fiber coupling. This includes selecting appropriate materials and controlling critical parameters. (3) Collaborate with IC and mechanical design teams to define and create structures that minimize stress, ensure thermal stability, and enhance the overall reliability of the package
Manufacturing & Collaboration: (1) Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production. (2) Define and manage critical process controls, alignment tolerances, and metrology methods to ensure consistent, high-performance output in a manufacturing environment. (3) Conduct in-depth analysis of assembly and packaging yield data to drive continuous process improvement
Reliability & Performance: (1) Define and implement test methodologies to characterize the reliability of packaged devices under various environmental and mechanical stresses. (2) Analyze reliability data to identify potential failure modes and work with design teams to implement corrective actions. (3) Utilize your understanding of thermal, modal, and stress/strain principles to predict and mitigate reliability risks associated with packaging
Qualification
Required
Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field
5+ years of hands-on experience in packaging design for optical or photonic components
Demonstrable experience with optical interfacing to PICs, including proficiency with active and passive alignment techniques
In-depth knowledge of packaging materials, including optical adhesives and epoxies, and their design constraints, and how to use them in a high reliability application
Proven ability to work with contract manufacturers to design, implement, and ramp packaging processes to volume production
A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia)
Experience with CAD tools for mechanical design and packaging layouts
Preferred
Direct experience with PIC optical edge coupling and associated challenges
Familiarity with various waveguide technologies and their impact on packaging design
Knowledge of semiconductor fabrication processes and their constraints on packaging
Experience with Finite Element Analysis (FEA) software for stress, thermal, or modal simulations
Excellent problem-solving skills and a track record of driving complex technical challenges from concept to solution
Strong communication and collaboration skills, with the ability to work effectively across interdisciplinary teams
Company
nEye.ai
We are nEye.ai, an optical switch startup founded in 2020 to revolutionize the future of data centers.
11-50 employees
H1B Sponsorship
nEye.ai has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
Funding
Current Stage
Growth StageTotal Funding
$72.54MKey Investors
CapitalGTEDA
2025-04-10Series B· $58M
2023-09-15Series A· $14.54M
Leadership Team
Tae Joon Seok
Chief Technology Officer & Co-Founder
Xiaosheng Zhang
Founding Engineer
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