Avicena Tech · 13 hours ago
Mechanical Packaging Engineer
Sunnyvale, CA
Full-time
Onsite
Mid Level
3+ years expAvicena Tech is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. The Mechanical Packaging Engineer will develop and support mechanical designs for advanced packaging and optical components, collaborating with cross-functional teams to meet product requirements and ensure manufacturing readiness.
ElectronicsIndustrial ManufacturingManufacturingSemiconductor
Responsibilities
Design and develop advanced packaging solutions using CAD tools (primarily SolidWorks), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines
Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution
Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness
Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability
Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs
Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations
Contribute to continuous improvement of engineering documentation, design standards, and development workflows
Qualification
Required
Bachelor's degree in Mechanical Engineering, Materials Engineering, or a related field, with 3+ years of experience in semiconductor advanced packaging and design
Strong proficiency in SolidWorks for 3D modeling and 2D drafting; experience with SolidWorks Visualize or similar rendering tools preferred
Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA)
Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus
Working knowledge of JEDEC and other relevant packaging standards
Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements
Proficient in Microsoft Office tools for documentation, reporting, and presentations
Excellent communication, documentation, and cross-functional collaboration skills
Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment
Strong analytical thinking and problem-solving skills
Preferred
Experience with SolidWorks Visualize or similar rendering tools
Familiarity with Ansys or equivalent multiphysics simulation tools
Company
Avicena Tech
Avicena Tech manufactures ultra-dense, ultra-low power petabit per second optical chip interconnects.
11-50 employees
H1B Sponsorship
Avicena Tech has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
Funding
Current Stage
Growth StageTotal Funding
$97.96MKey Investors
Tiger Global ManagementNational Science Foundation
2025-05-14Series B· $65M
2022-08-02Series A· $25M
2021-02-01Grant· $0.26M
Leadership Team
Bardia Pezeshki
Founder, CEO, CTO
Chris Pfistner
VP, Sales & Marketing
Recent News
Morningstar.com
2025-09-29
Crunchbase News
2025-05-16
Google Patent
2025-05-04
Company data provided by crunchbase