PhD Intern, Packaging Structural Engineering Summer 2026 jobs in United States
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Sandisk · 5 days ago

PhD Intern, Packaging Structural Engineering Summer 2026

positionMilpitas, CA
timeInternship
remoteHybrid
seniorityIntern
workcardStart in 2026 Summer

Sandisk is a leading company in the computer hardware industry, known for its innovative solutions in Flash and advanced memory technologies. The Packaging Structural Engineering intern will work in the Packaging R&D group, focusing on testing, modeling, and simulation related to semiconductor packaging and flash memory products, while addressing mechanical design and structural reliability issues.

SemiconductorBig DataManufacturingData Storage
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H1B Sponsor Likelynote

Responsibilities

Conducting simulation tasks of mechanical responses of IC package and flash products
Advancing simulation tools for multiscale, multiphysics problems leading to damage and fracture
Analyzing, documenting and reporting testing and simulation results
Proposing engineering solutions to existing and future challenges facing data storage industry

Qualification

PhD in Mechanical EngineeringCADCAE toolsProgramming languageMicroelectronics packagingMicrosoft OfficeWork ethicsCommunication skills

Required

Current student, pursuing a Ph.D. degree in Mechanical Engineering or a relevant major graduating in 2027
Interest in microelectronics packaging industry
Proficient in CAD and CAE tools, and a programming language
Proficient in Microsoft Office applications
Demonstrated strong work ethics

Preferred

Exceptional written and verbal communication skill

Company

Sandisk

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SanDisk designs, develops, manufactures, and markets data storage solutions in the United States and internationally.
dateFounded in 1988
location
Milpitas, California, USA
people-size5001-10000 employees
web-link
https://www.sandisk.com/en-in

H1B Sponsorship

Sandisk has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (210)

Funding

Current Stage
Public Company
Total Funding
$713.58M
2025-06-06Post Ipo Secondary· $713.58M
2015-10-21Acquired
1995-11-17IPO

Leadership Team

N
Netanel Nutman
Senior Manager , Software/Protocol Testing
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Recent News

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2026-02-08
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2026-02-08
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Company data provided by crunchbase