Senior Silicon Design Engineer - Packaging and Co-Design - TeraWave jobs in United States
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Blue Origin · 8 hours ago

Senior Silicon Design Engineer - Packaging and Co-Design - TeraWave

Blue Origin envisions millions of people living and working in space for the benefit of Earth. They are seeking a Senior Silicon Design Engineer specializing in Packaging and Co-Design for their TeraWave satellite communications network, which aims to deliver high-speed data connectivity globally.

AerospaceManufacturingNational SecurityRenewable Energy
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Responsibilities

Define and architect custom silicon solutions including DSPs, SDR components, beamforming processors, and network processing units optimized for advanced packaging technologies
Lead technical architecture decisions and requirements definition for space-optimized processing solutions with focus on heterogeneous integration
Drive 2.5D and 3D packaging strategies including silicon interposers, chiplets, and advanced substrate technologies
Lead end-to-end ASIC/FPGA development from requirements through RTL design, verification, synthesis, physical design, and post-silicon validation
Develop co-design methodologies integrating electrical, thermal, and mechanical considerations for complex multi-die packages
Manage design flows and coordinate with foundry and packaging partners to ensure manufacturability
Implement and verify radiation tolerance techniques including SEU mitigation, TMR, ECC, and RHBD methodologies
Coordinate radiation testing and qualification campaigns to ensure space survivability
Drive design standards, verification strategies, IP library development, and documentation for advanced packaging
Establish design flows and best practices for space-grade silicon engineering across the program
Collaborate cross-functionally with systems engineers, RF engineers, avionics teams, thermal engineers, and software developers
Support requirements flow-down and interface definitions between chiplets and package components
Lead technical risk assessment and Failure Investigation Teams (FITs) for silicon design issues, radiation-induced failures, and flight anomalies
Develop mitigation strategies and corrective actions for packaging-related challenges
Provide recommendations for capital investments in EDA tools, verification platforms, emulation systems, and validation equipment

Qualification

Silicon designAdvanced packaging technologiesSystem-in-package designHeterogeneous integration2.5D/3D packagingHigh-speed signalingThermal co-designMechanical co-designRadiation tolerance techniquesEDA tools proficiencyTechnical risk assessmentFailure investigationMitigation strategiesCross-functional collaboration

Required

B.S. degree in Electrical Engineering, Computer Engineering, or related field
8+ years of experience in silicon design with focus on advanced packaging technologies
Demonstrated expertise in system-in-package design and heterogeneous integration
Experience with 2.5D/3D packaging technologies including interposers and chiplets
Knowledge of high-speed signaling in advanced packages
Experience with thermal and mechanical co-design for complex silicon solutions
Understanding of radiation effects on semiconductor devices and packaging materials
Proficiency with industry-standard EDA tools for package design and simulation

Preferred

M.S. or Ph.D. in Electrical Engineering with focus on semiconductor packaging
Experience with space-grade packaging technologies and qualification processes
Knowledge of RF/microwave packaging techniques for high-frequency applications
Experience with power delivery network design for complex multi-die packages
Background in designing for harsh environments including thermal cycling and radiation
Experience with silicon photonics integration and optical I/O technologies
Understanding of advanced cooling solutions for high-performance computing in space
Familiarity with reliability physics and failure mechanisms in advanced packages

Benefits

Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

Company

Blue Origin

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Blue Origin is an aerospace company that focuses on lowering the cost of spaceflight and helping to explore the solar system.

Funding

Current Stage
Late Stage
Total Funding
$185.35M
Key Investors
NASAUnited States Space Force
2024-02-20Secondary Market
2024-01-24Undisclosed· $18M
2021-12-03Grant· $130M

Leadership Team

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David Limp
Chief Executive Officer
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Tim Collins
Vice President, Global Supply Chain
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Company data provided by crunchbase