Qualcomm · 1 week ago
Server Finite Element Analysis (FEA) Engineer
Santa Clara, California, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$180K/yr - $271K/yr
4+ years expQualcomm is dedicated to transforming the industry by developing next-generation computing platforms. They are seeking a Staff / Senior Staff Server FEA Engineer to lead structural simulation and system-level modeling of high-performance server platforms, ensuring mechanical robustness and reliability from package through in-rack deployment.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Lead multi-scale FEA across package, board, chassis assembly, system, and rack levels
Own system-level structural simulation, including server chassis assemblies, multi-node integration, and in-rack boundary conditions
Lead structural dynamics modeling (modal, shock, drop, random vibration, harmonic response, coupled system dynamics)
Drive platform-level structural architecture through simulation-based decisions
Correlate analytical models with component-, system-, and rack-level test data
Define and maintain platform simulation methodologies, modeling standards, and validation frameworks
Translate simulation into clear design guidance for cross-functional teams
Present technical analyses to engineering leadership, customers, and suppliers
Qualification
Required
Master's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
Strong background in structural mechanics, materials science, and structural dynamics
6+ years of advanced FEA experience in high-tech hardware platforms spanning microelectronics packaging, BGAs/sockets, board-level systems, server chassis assemblies, and full system-level structures
Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent
Experience correlating system-level FEA with physical testing (modal, shock, vibration, environmental)
Strong technical documentation and communication skills
Proven ability to operate independently and lead within cross-functional teams
Preferred
Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
10+ years of advanced FEA experience
Expertise in structural and system-level FEA
Experience with rack-scale modeling and in-rack boundary condition simulation
Deep experience in holistic structural analysis spanning die, package, board, chassis, and rack-integrated systems
Experience with multi-physics coupling (structural–thermal–mechanical)
Platform-level simulation ownership across multiple server generations
Understanding of OCP product designs and industry best practice
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President & CEO
I
Isaac Eteminan
CEO
Recent News
2026-02-05
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2026-02-05
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