Accelsius · 17 hours ago
Associate Solutions Architect
Accelsius LLC is an Austin-based leader in innovative two-phase, direct-to-chip liquid cooling solutions for the AI and high-performance computing (HPC) era. They are seeking a motivated Associate Solutions Architect to join their technical pre-sales and solutions team, where the role involves designing and proposing tailored liquid cooling architectures and collaborating with customers and sales teams to meet facility requirements.
Cloud ComputingData CenterHardwareManufacturingSoftware
Responsibilities
Collaborate closely with sales teams and customers to gather and analyse requirements for high-density computing environments, including heat loads, rack configurations, redundancy needs, energy efficiency targets, and integration with existing infrastructure
Develop and propose liquid cooling solutions based on NeuCool technology, including direct-to-chip cold plates, manifold systems, CDUs, fluid loops, and heat rejection strategies
Assist in creating technical architectures, conceptual designs, performance calculations (e.g., thermal resistance, capacity sizing, PUE impact), and scalability assessments for AI, HPC, and mission-critical workloads
Prepare accurate technical proposals, presentations, diagrams, BOMs, and pricing documentation to communicate solution value to clients and stakeholders
Conduct technical presentations (virtual and in-person), participate in customer workshops, and support site surveys or evaluations for pre-installation validation
Occasionally assist with on-site installation support alongside service teams during commissioning or deployments
Serve as a subject matter expert at industry events, conferences, and trade shows to represent Accelsius and NeuCool technology
Ensure designs align with industry standards, safety requirements (using non-conductive, dielectric refrigerants), and sustainability goals (e.g., waterless operation, energy savings)
Contribute to internal tools, templates, and knowledge bases to streamline solution development
Creating, interpreting and editing mechanical drawings. CAD skills essential
Qualification
Required
Bachelor's degree in Mechanical Engineering or a closely related field (or equivalent journeyman experience in mechanical systems, HVAC, or thermal management)
1–4 years of relevant experience in MEP/HVAC design, thermal management, data center infrastructure, or technical support roles—ideally with exposure to liquid cooling, precision cooling, or critical facility systems (experience or projects involving data center mechanical services, direct-to-chip cooling, or providers like Vertiv, Schneider, STULZ, Airedale, or similar is highly valued)
Strong understanding of thermal principles, heat transfer, fluid dynamics, and cooling system design for high-performance environments
Excellent analytical, problem-solving, and detail-oriented skills
Strong communication abilities—able to explain complex technical concepts to diverse audiences (technical engineers, IT teams, executives)
Proficiency in Microsoft Office (Excel, PowerPoint, Word); familiarity with diagramming or CAD tools (e.g., Visio, AutoCAD basics) is a plus
Authorized to work in the United States. No sponsorship or visa support offered
Preferred
Exposure to liquid cooling technologies, two-phase systems, direct-to-chip cooling, or data center thermal challenges (e.g., high-density GPU/CPU cooling, AI workloads)
Basic knowledge of data center standards (e.g., ASHRAE, OCP), energy modeling, or integration with facility systems
Experience in customer-facing, consulting, or pre-sales technical roles
Enthusiasm for fast-paced start-up culture—adaptable, proactive, and excited by ambiguity and growth opportunities
Benefits
Comprehensive benefits package (health, dental, vision, 401(k), etc.)
Company
Accelsius
Accelsius specializes in direct-to-chip liquid cooling solutions, providing efficient cooling for data centers.
Funding
Current Stage
Growth StageTotal Funding
$154.56MKey Investors
Johnson ControlsInnventure
2026-01-12Series B· $65M
2025-10-06Corporate Round· $65M
2024-11-13Series A· $24M
Recent News
2026-01-16
2026-01-15
Venture Capital
2026-01-14
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