3D Glass Solutions, Inc. · 2 weeks ago
Copper Plating Engineering Group Leader
Albuquerque, New Mexico, United States
Full-time
Onsite
Senior Level, Lead/Staff
5+ years exp3D Glass Solutions, Inc. is seeking a Copper Plating Engineering Group Leader to lead process development and provide manufacturing support for advanced copper plating technologies. This role requires deep technical expertise in electroplating and electroless copper processes, along with the ability to mentor and guide a team of process engineers.
Electronics
No H1B
U.S. Citizen Only
Responsibilities
Lead and manage a team of process engineers focused on copper plating and related unit processes
Drive experimental design, execution, and data analysis to optimize plating performance, yield, and reliability
Provide hands-on technical leadership in lab and production environments, including tool setup, process tuning, and troubleshooting
Develop, qualify, and maintain copper plating processes for wafer-level and/or panel-level manufacturing
Serve as the technical owner for copper electroplating and electroless plating modules
Collaborate cross-functionally with equipment, integration, yield, reliability, and manufacturing teams
Establish robust problem-solving methodologies (DOE, SPC, FMEA, root cause analysis) to address process challenges
Support technology transfers from R&D to high-volume manufacturing
Mentor junior engineers and elevate the overall team's technical capability
Interface with chemical and equipment suppliers for process optimization and roadmap alignment
Perform additional functions and other duties as assigned or required
Qualification
Required
Bachelor's degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, or a related field required
5-10 years of industry experience in copper plating or advanced packaging process engineering
Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently
This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements
Demonstrated experience leading technical teams or serving as a senior technical authority
Proven track record of solving complex plating and integration challenges
Experience with plating equipment operation, optimization, and qualification
Experience with plating chemistry additives, including suppressors, accelerators, and levelers
Knowledge of wafer-level and/or panel-level plating process development and manufacturing
Knowledge of microvia electroplating and void-free fill techniques
Knowledge of plating seed layer etching and related metallization removal processes
Experience in through Glass Via (TGV) filling
Familiarity with high-volume manufacturing requirements and process control methodologies
Ability to balance technical depth with project and people leadership
Excellent communication and mentoring skills
Supplier and equipment vendor engagement experience
Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments
Experience in through Silicon Via (TSV) filling
Knowledge of photoresist stripping and post-plating cleaning processes
Experience with redistribution Layer (RDL) electroplating
Knowledge of electroless copper plating chemistries, including copper seed layer formation
Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating
Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions
Strong experimental design and data analysis skills
Must be able to wear personal protective gear most of the day (where applicable)
Prolonged periods of sitting or standing
Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders
A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments
The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization
Company
3D Glass Solutions, Inc.
3D Glass Solutions, Inc. (3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico.
51-200 employees
Funding
Current Stage
Growth StageTotal Funding
$66.07MKey Investors
Walden CatalystNew Mexico Economic Development DepartmentIntel Capital
2023-04-19Series C· $30M
2022-06-03Grant· $0.07M
2022-01-31Series B· $4M
Leadership Team
Jeb Flemming
Founder, Chief Technology Officer @ 3D Glass Solutions, Inc.
Recent News
2025-09-25
2025-09-04
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