LufCo · 6 hours ago
Mechanical Engineer - Thermal Analysis (RF Systems)
LufCo is seeking a Mechanical Engineer with a specialized focus on the thermal management of high-power RF electronics. This role involves ensuring the thermal architecture of mission-critical DoD systems and driving the design of ruggedized enclosures from concept through environmental qualification.
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Responsibilities
Advanced Multiphysics Modeling: Utilize CST Studio Suite to perform coupled EM-Thermal simulations. Quantify how RF losses (insertion loss, dielectric loss) translate into thermal loads
Electronics Packaging: Aid in the design and optimization of enclosures for SWaP-constrained environments, ensuring high-power components like GaN (Gallium Nitride) power amplifiers remain within junction temperature limits
Environmental Compliance: Ensure all mechanical designs meet stringent DoD survivability requirements, including thermal shock, solar radiation, and extreme ambient operating temperatures
Subsystem Integration: Direct the design of advanced cooling solutions, including micro-channel liquid cooling, phase-change materials (PCM), and high-conductivity thermal interface materials (TIMs)
Qualification
Required
BS in Mechanical Engineering with a focus on Heat Transfer or Fluid Dynamics
7+ years of relevant engineering experience
5+ years of experience with CST Studio Suite (specifically the Thermal and Conjugate Heat Transfer solvers)
Proven experience designing to and testing for MIL-STD-810H: Environmental Engineering Considerations (Temperature, Humidity, Altitude, Vibration)
Proven experience designing to and testing for MIL-HDBK-217: Reliability Prediction for Electronic Equipment
Proven experience designing to and testing for MIL-STD-461G: Requirements for the Control of Electromagnetic Interference (understanding the thermal impact of EMI shielding/gaskets)
Knowledge of AlSiC, graphite foam, or synthetic diamond heat spreaders for high-flux RF components
Experience with heat pipes, vapor chambers, or pumped two-phase cooling cycles for high-density electronics
Experience using IR thermography and fiber-optic temperature sensors to validate CST models against physical prototypes
Active Secret Clearance Required; Ability to obtain TS/SCI
Ability to travel as required
Preferred
MS is preferred
Benefits
Paid Time Off
401K Contribution and Employer Match Contributions
Medical, Dental, and Vision Coverage