Amazon · 19 hours ago
Sr PCBA Manufacturing Engineer, Trainium Manufacturing, Quality and Reliability
Austin, Texas, USA
Full-time
Onsite
Senior Level
$159K/yr - $215K/yr
6+ years expAmazon is a leading cloud services provider seeking a Senior PCBA Manufacturing Engineer to join the Annapurna Labs team. The role involves leading the manufacturing of AI servers based on Trainium chips, collaborating with cross-disciplinary teams to enhance product quality and efficiency, and driving manufacturing readiness and operational success.
Artificial Intelligence (AI)DeliveryE-CommerceFoundational AIRetail
Responsibilities
Work with the Design Engineering team to provide PCB/PCBA DFM feedback. Identify and escalate PCBA manufacturing challenges early in product development
Identify opportunities for risk reduction and simplification of PCBA manufacturing processes
Deliver manufacturing processes capabilities including equipment capability, quality controls, materials characterization, and standardized rework practices
Investigate and develop new manufacturing technology and methodologies to enhance PCBA quality, reliability, throughput, and cost
Drive the PCBA Manufacturing Qualification process at the CM. Define manufacturing readiness requirements and lead key milestone reviews to ensure all production readiness deliverables are complete
Lead identifying and validating product/component risks and work with design teams to mitigate them and define the test methodology and test coverage to assure product quality
Drive closure of all operational issues during pre-production builds. Work within Operations, Supply Chain, R&D, and Reliability Engineering to implement and optimize manufacturing processes and improve yields for production ramp
Investigate failures/defects in production, test, and integration. Identify and mitigate underlying root causes to prevent reoccurrence as part of continuous improvement efforts
Actively monitor the success of products and processes through production ramp. Provide regular status reports of PCBAs progress from design to production
Provide technical leadership and mentor engineers
Working with multiple vendors and ODMs to standardize component manufacturing and reliability expectations
Qualification
Required
Bachelor's degree or above in Mechanical, Electrical, Industrial Engineering, or related STEM field
6+ years of root cause analysis and process design experience
7+ years of including new product introduction (NPI) experience
Experience: 5+ to 8+ years in SMT and PCBA process engineering, including high-volume production
Technical Skills: Deep knowledge of SMT line processes (stencil, SPI, pick-and-place, reflow, AOI, X-ray)
Manufacturing Knowledge: Expertise in Design for Manufacturability (DFM) and Design for Testability (DFT)
Preferred
Master's degree, or experience with DFx (Design for cost, test, manufacturing)
Education: Master's degree in Electrical, Mechanical, or Manufacturing Engineering
Industry Standards: Expert knowledge of IPC-A-610H, J-STD-001H, IPC-A-600, and IPC-7711/21
Process Knowledge: Strong experience with SMT lines, including stencil printing, Pick & Place, Reflow, Automated Optical Inspection (AOI), 5DX, and conformal coating/underfill application
Testing & Analysis: Experience with flying probe testing, Design of Experiments (DOE), and root cause analysis tools like 8D or Six Sigma
Software/Systems: Familiarity with PLM/PDM systems (Agile, Teamcenter, SAP) and ERP/MES systems
Benefits
Health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
401(k) matching
Paid time off
Parental leave
Company
Amazon
Amazon is a tech firm with a focus on e-commerce, cloud computing, digital streaming, and artificial intelligence.
10001+ employees
H1B Sponsorship
Amazon has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (22803)
2024 (21175)
2023 (19057)
2022 (24088)
2021 (12233)
2020 (14881)
Funding
Current Stage
Public CompanyTotal Funding
$8.11BKey Investors
AmazonKleiner Perkins
2023-01-03Post Ipo Debt· $8B
2001-07-24Post Ipo Equity· $100M
1997-05-15IPO
Leadership Team
Douglas J. Herrington
CEO, Worldwide Amazon Stores
Werner Vogels
VP & CTO
Recent News
San Bernardino Sun
2026-02-04
2026-02-04
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