WHOOP · 2 hours ago
Manufacturing Engineer II (NPI)
WHOOP is on a mission to unlock human performance and healthspan. As a Manufacturing Engineer II on the NPI team, you will develop and troubleshoot manufacturing processes while ensuring high quality and efficiency from early development through mass production.
Consumer ElectronicsFitnessSportsWearablesWellness
Responsibilities
Drive manufacturing technical readiness across NPI builds (prototype, EVT, DVT, PVT) through process development, documentation, and validation
Partner with internal engineering teams and contract manufacturing partners to deliver DFX feedback, with a focus on highly automated assembly systems
Support in-house prototype build preparation and execution, including development of assembly procedures, fixtures, and build documentation
Coordinate with factory teams and manufacturing partners on the design, build, and qualification of fixtures, equipment, and highly automated manufacturing processes to support scalable production
Develop, maintain, and release manufacturing documentation, including drawings, SOPs, PFMEAs, work instructions, qualification protocols, and root cause reports
Define and execute DOEs, conduct failure analysis, and apply structured problem-solving methodologies (DMAIC, 8D) to identify root causes and drive corrective and preventive actions
Define manufacturing requirements for automation and MES integration, including part traceability and data collection to support quality, yield, and process control
Ensure manufacturing processes meet product specifications and quality requirements through data-driven process controls, verification, and analysis
Communicate manufacturing status, risks, issues, and build readiness across cross-functional stakeholders
Support parallel-path and contingency efforts for high-risk milestones and build phases
Willingness to travel up to 25% globally
Qualification
Required
Bachelor's degree in Mechanical, Manufacturing, Electrical Engineering, or a related technical field
3+ years of manufacturing engineering experience supporting moderate to high-volume consumer electronics products with an emphasis on automated assembly systems
Working knowledge of injection molding, metals, ceramics, and related materials used in precision electromechanical assemblies
Hands-on experience with adhesive bonding, heat staking, glue dispensing, and battery assembly
Experience developing, validating, and ramping manufacturing processes across manual and highly automated assembly operations
Solid understanding of tolerance stack-up analysis for high-volume manufacturing and applying appropriate dimensioning strategies to evaluate process capability
Familiarity with MES systems and manufacturing data infrastructure, including part traceability, process data collection, and statistical process control (SPC)
Demonstrated ability to qualify manufacturing processes, troubleshoot issues on the factory floor, and drive corrective actions to closure
Proficiency in SolidWorks with best practices for fixture, tooling, and equipment design
Strong organizational and prioritization skills in a fast-paced, cross-functional environment
Experience working effectively with internal engineering teams and external manufacturing partners within a CM/JDM operating model
Benefits
Competitive base salaries
Meaningful equity
Benefits
A generous equity package
Company
WHOOP
WHOOP is a fitness tech company that offers wearables that track sleep, recovery, and performance.
H1B Sponsorship
WHOOP has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (32)
2024 (18)
2023 (15)
2022 (5)
2021 (17)
2020 (6)
Funding
Current Stage
Late StageTotal Funding
$404.75MKey Investors
SoftBank Vision FundIVPFoundry Group
2026-01-15Undisclosed
2021-08-30Series F· $200M
2020-10-28Series E· $100M
Recent News
2026-01-21
2026-01-20
Company data provided by crunchbase