Process Engineering Intern - Summer/Fall 2026 jobs in United States
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Lam Research · 22 hours ago

Process Engineering Intern - Summer/Fall 2026

Lam Research is dedicated to excellence in the design and engineering of etch and deposition products for the semiconductor industry. The role involves contributing to the advancement of wafer fab equipment processes, enhancing reactor performance, and supporting research and development activities.

CleanTechManufacturingSemiconductor
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Contribute to engineering projects by applying electrodeposition techniques to develop new features on the Lam SABRE system, aiming to enhance reactor and equipment performance
Assist with testing and characterizing new or modified process formulations for product development and technology improvement
Set up and run bench-scale experiments, operate application lab deposition development tools, and perform chemistry and material analysis
Utilize metrology tools to measure and analyze wafer deposition performance
Support research and development activities, including compiling and organizing data and conducting scientific journal research

Qualification

ElectrodepositionChemical EngineeringWet Laboratory ExperienceTroubleshooting EquipmentElectrochemistry KnowledgeData CompilationCollaborationProblem-Solving

Preferred

Pursuing a Master's or PhD degree in Chemical Engineering, Chemistry, Mechanical Engineering, or Material Science
Available to intern for 6-months from May/June to November/December
Hands on experience working in wet laboratory
Have experience working on troubleshooting complex equipment and systems
Knowledge in electrochemistry is a plus

Benefits

Comprehensive set of outstanding benefits

Company

Lam Research

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Lam Research supplies wafer fabrication equipment and services to the worldwide semiconductor industry.

H1B Sponsorship

Lam Research has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (239)
2023 (170)
2022 (216)
2021 (242)
2020 (182)

Funding

Current Stage
Public Company
Total Funding
unknown
1984-05-11IPO

Leadership Team

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Tim Archer
President and CEO
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Rick Gottscho
Exec VP and CTO
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Company data provided by crunchbase