Leidos · 10 hours ago
Electrical Hardware Design Engineering Intern
Huntsville, AL
Internship
Onsite
Intern
$48K/yr - $87K/yrLeidos Defense Systems is seeking an Electrical Hardware Design Engineering Intern to join their diverse team. The role involves assisting in the design, simulation, modeling, and testing of hardware solutions while providing opportunities for technical growth and hands-on experience in the defense and aerospace fields.
ComputerGovernmentInformation ServicesInformation TechnologyNational SecuritySoftware
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Assist in the design, simulation, modeling and testing of hardware solutions
Working with design tools such as Mentor Graphics, Altium for PCB design, SPICE, and Visio
Develop and execute hardware verification plans
Debug hardware using test equipment such as oscilloscopes and signal generators
Collaborate with team members on hardware projects
Qualification
Required
Currently enrolled in an accredited college / university and currently working towards a degree in Electrical Engineering or a related field
Holds a GPA of 3.0 or higher
Includes resume and unofficial transcripts in application
Demonstrates problem solving, teamwork, and communication skills
Basic understanding of circuit theory and design
Experience programming in VHDL, Verilog, Python, SPICE, or C/C++
Experience with hardware testing for functionality
Must be a US Citizen and be able to obtain and maintain a DoD Secret security clearance
Preferred
Design, test, troubleshooting, and manufacture of complex multi-layer electronic circuit card assemblies
Digital design and troubleshooting in the area of embedded processors, microcontrollers, or VHDL-based FPGAs
Switched-mode power supply (SMPS) design
Mentor Graphics electrical engineering development tools
Company
Leidos
Leidos is a Fortune 500® innovation company rapidly addressing the world’s most vexing challenges in national security and health.
Founded in 1969
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
unknown2025-02-20Post Ipo Debt
2013-09-17IPO
Leadership Team
James Carlini
Chief Technology Officer
Theodore Tanner
Chief Technology Officer
Recent News
MarketScreener
2025-12-16
2025-12-16
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