Embedded Design Engineering Intern – Firmware jobs in United States
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Leidos · 8 hours ago

Embedded Design Engineering Intern – Firmware

Leidos Defense Systems is seeking a talented Embedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development to post-delivery support.

ComputerGovernmentInformation ServicesInformation TechnologyNational SecuritySoftware
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Designing embedded software and firmware
Performing HDL simulations and software unit tests
Hands-on laboratory testing with instrumentation, test equipment, and debug/test methods
Performing in a collaborative engineering environment working closely with multi-disciplinary teams
Working with platforms such as FPGAs, microcontrollers, microprocessors, and mixed signal designs

Qualification

CC++Embedded software programmingFPGA design toolsVHDLVerilogRISC microprocessorsGNU/LinuxCommunication protocolsEmbedded operating systemsElectronics designProblem solvingTeamworkCommunication skills

Required

Currently enrolled in an accredited college / university and currently working towards a degree in Computer Engineering or a related field
Experience with C, C++, or Rust embedded software programming through course work, lab projects, and previous internships
Demonstrates problem solving, teamwork, and communication skills
Holds a GPA of 3.0 or higher
Includes resume and unofficial transcripts in application
Must be a US Citizen and be able to obtain and maintain a DoD Secret security clearance

Preferred

Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
Basic knowledge of FPGA/Firmware languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
Experience with simulation and test frameworks
RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
Memory architectures, types, and caching
GNU/Linux and developing kernel drivers
Communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc
Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, Zephyr, uC/OS-II)
Electronics and PCBA design
Leading design teams including technical leadership, budgeting, and scheduling

Company

Leidos is a Fortune 500® innovation company rapidly addressing the world’s most vexing challenges in national security and health.

Funding

Current Stage
Public Company
Total Funding
unknown
2025-02-20Post Ipo Debt
2013-09-17IPO

Leadership Team

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James Carlini
Chief Technology Officer
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Theodore Tanner
Chief Technology Officer
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Company data provided by crunchbase