Hardware Systems Engineering jobs in United States
cer-icon
Apply on Employer Site
company-logo

Apple · 1 day ago

Hardware Systems Engineering

Apple is a place where extraordinary people gather to do their lives best work. The role involves designing, integrating, and validating electrical engineering subsystems for the iPhone, performing failure analysis, and ensuring reliability during mass production.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Design, integrate, and validate electrical engineering subsystems for iPhone
Perform failure analysis, root cause investigation, and mitigation development of electrical failures
Develop testing and monitor performance of electrical subsystems during production to ensure reliability and manufacturability mass production over millions of units
Work with cross-functional technology teams to facilitate and validate integration of multidisciplinary systems
Analyze and weigh system trade-offs in order to develop robust and reliable designs
Own designs that continually push the boundaries of technology and ultimately improve the iPhone user experience

Qualification

High density PCB designCadence AllegroElectrical schematicsMicrocontroller architectureBASH scriptingHigh-speed interfacesData analysisTeam collaborationProblem-solvingCommunication skills

Required

Bachelor's Degree or foreign equivalent in Systems Design Engineering, Computer Science or related field and 1 year of experience in the job offered or related occupation
1 year of experience with each of the following skills is required:
Experience working with high density rigid and flexible printed circuit designs, including initial requirement specification, component placement and trace layout
Incorporating manufacturing design rules for high volume and high precision electrical circuit boards
Experience with HDI (high density interconnect) circuit boards and layout tools Cadence Allegro
Experience with complex electrical schematics spanning 100+ pages, and hierarchical design practices and design version control tools such as git
Using schematic entry tool Cadence System capture and associated tool suites
Using electronic/electric measurement and debugging equipment & tools such as oscilloscopes, signal analyzers, CT (computed tomography), LIT (laser infrared thermography) and TDR (Time domain reflectometer)
Scripting in BASH to optimize prototype configuration, including experience writing, modifying and maintaining complex test station interface scripts for mass production factory environments
Experience with microcontroller and SOC (System on Chip) architecture to program interface protocols and data processing routines on high-speed digital and analog electric circuitry
Experience with high-speed interfaces such USB 2.0, 3.0 and 3.1, PCIE, LPDP, MIPI and SPMI
Experience in data collection, analysis and preparation for high-quality presentation material at executive leadership level

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

leader-logo
Tim Cook
CEO
leader-logo
Craig Federighi
SVP, Software Engineering
Company data provided by crunchbase