IBM · 8 hours ago
Entry Level Hardware and Systems Engineer
Hopewell Junction, NY
Full-time
Onsite
New Grad, Entry LevelIBM is seeking an Entry-Level Materials / Chemical Engineer to support the development and qualification of packaging materials for semiconductor packaging. This hands-on role involves collaborating with design, reliability, and manufacturing teams to conduct experiments and analyze materials performance.
Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
Responsibilities
Supporting materials and process development for semiconductor packaging technologies (e.g., underfill, die attach, encapsulation, substrates)
Executing hands-on lab experiments, process trials, and development builds
Leading materials characterization and analysis to evaluate thermal, mechanical, and chemical performance
Assisting with failure analysis and root cause investigations related to packaging materials and processes
Collecting, analyzing, and documenting experimental data; preparing technical summaries and reports
Collaborating with cross-functional teams including packaging design, mechanical engineering, reliability, and manufacturing
Supporting technology qualification, readiness, and transfer to manufacturing
Qualification
Required
BS Materials Engineering, Chemical Engineering, Chemistry or a related field
Experience with design of experiments (DOE) and/or project management
Experience or strong interest in process development, materials development, semiconductor packaging and hardware systems
Hands-on experience through academic labs, internships, co-ops, or senior design projects
Fundamental understanding of materials behavior (polymers, metals, composites)
Strong analytical and communication skills, with a focus on collaboration and data-driven problem solving
Preferred
Master's Degree
Company
IBM
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
Founded in 1911
10001+ employees
H1B Sponsorship
IBM has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)
Funding
Current Stage
Public CompanyTotal Funding
unknown2011-01-14IPO
Leadership Team
Alain Bénichou
Chief Executive Officer, IBM Greater China Group
Alex Yang
CTO and Chief Architect
Recent News
2026-01-25
2026-01-24
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