Nanoscale Device Process Integration Principal Engineer, R&D Engineering jobs in United States
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Western Digital · 12 hours ago

Nanoscale Device Process Integration Principal Engineer, R&D Engineering

Western Digital is a leading company in computer hardware, dedicated to powering global innovation. They are seeking a Principal Engineer for their R&D Engineering team, focusing on the fabrication of nanoscale devices for various exploratory projects, including artificial nanopores and superconducting electronics.

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H1B Sponsor Likelynote

Responsibilities

The job opening is for a full-time Research Staff Member in the Western Digital Corporation emerging device fabrication group
The mission of the group is to build nanoscale devices for a range of exploratory projects such as artificial nanopores, novel magnetic biosensors, nanofluidic devices, superconducting qubits, non-volatile memories, superconducting electronics, etc
We are looking for a scientist/engineer with a strong background in nanoscale device processing, and, if possible, experience fabricating nanoscale devices for biological or medical applications
Candidates should have hands-on expertise in device integration and nanoscale process equipment
The device fabrication is performed in a state-of-the art research cleanroom on our San Jose headquarters campus
You will be joining a fabrication team of 20+ engineers and technicians with nearly 500 years of combined nanofabrication experience

Qualification

Nanoscale device processingNanofabrication metrology equipmentDevice integrationCleanroom process toolsFailure analysisSelf-directed researchCommunication skills

Required

Minimum of a Master's degree in Chemistry, Chemical Engineering, Physics, Materials Science, Electrical Engineering, or closely related field with 5+ years of professional experience or a Ph.D. with 2+ years is required
Hands-on experience with a range of nanofabrication metrology equipment including SEM and AFM
Demonstrated ability to self-direct a research project
Strong communication skills and the ability to work both independently and in a team environment
Experience in device integration (CAD/mask layout/designing process flows/running process lots)
Experience in failure analysis and process debugging

Preferred

Hands-on experience with cleanroom process tools

Benefits

Paid vacation time
Paid sick leave
Medical/dental/vision insurance
Life, accident and disability insurance
Tax-advantaged flexible spending and health savings accounts
Employee assistance program
Other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
Tuition reimbursement
Transit
The Applause Program
Employee stock purchase plan
Western Digital Savings 401(k) Plan

Company

Western Digital

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Western Digital helps customers capture, preserve, access, and transform an ever-increasing diversity of data.

H1B Sponsorship

Western Digital has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (234)
2024 (537)
2023 (448)
2022 (580)
2021 (525)
2020 (332)

Funding

Current Stage
Public Company
Total Funding
$901.37M
2023-10-31Post Ipo Debt· $1.37M
2023-01-31Post Ipo Equity· $900M
2015-09-30Post Ipo Equity

Leadership Team

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Sesh Tirumala
SVP, CIO
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A
Alvin B. Phillips
Founder
Company data provided by crunchbase