CMP Process Engineer jobs in United States
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IBM · 18 hours ago

CMP Process Engineer

IBM Research is the innovation engine of IBM, focusing on advanced computing technologies. The CMP Process Engineer will drive the research and development of planarization technologies for nanoscale devices, collaborating with various experts to enable end-to-end module integration.

Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
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H1B Sponsor Likelynote

Responsibilities

Drive the research, development and optimization of planarization technologies supporting current and future nanoscale devices and integration schemes
Develop new CMP processes working in a dynamic R&D environment that uses an interdisciplinary approach—combining materials science, surface science, electrochemistry, and physical characterization
Create and optimize processes for CMOS and interconnect fabrication at upcoming technology nodes through both internal collaboration and external partnership projects
Work closely with wafer lot owners and subject experts in lithography, plasma processing, electrodeposition, and other semiconductor processes to enable end‑to‑end module integration
Lead fabrication of novel device structures—including those for Quantum, AI, and magnetic random‑access memory (MRAM)

Qualification

CMP process engineeringSemiconductor processingWafer handlingMaterials scienceSurface scienceElectrochemistryPhysical characterizationTechnical leadershipCollaborationCommunication skills

Required

BS or MS in chemistry, physical chemistry, chemical engineering, surface science, or related field
Prior wafer handling experience
Semiconductor processing experience

Preferred

Master's Degree
3-5 years Prior wafer-level, semiconductor processing experience

Company

IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.

H1B Sponsorship

IBM has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)

Funding

Current Stage
Public Company
Total Funding
unknown
2011-01-14IPO

Leadership Team

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Alain Bénichou
Chief Executive Officer, IBM Greater China Group
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Alex Yang
CTO and Chief Architect
Company data provided by crunchbase