IBM · 5 hours ago
Quantum Signal Integrity and Mechanical Packaging Scientist / Engineer
Yorktown Heights, NY
Full-time
Onsite
Mid, Senior Level
2+ years expIBM Research is the innovation engine of IBM, exploring the future of computing and pioneering practical quantum computing. The role focuses on scaling quantum processors while ensuring signal integrity and reliability, collaborating with a multidisciplinary team to overcome technical challenges.
Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
Responsibilities
Help enable IBM to scale up our quantum processors while maintaining leading signal integrity, shielding and reliability of the overall system
Speak to physicists, engineers and technicians to help solve the challenges encountered when scaling up superconducting quantum processors to the sizes needed for fault tolerant quantum computing
Qualification
Required
Masters in physics, electrical engineering or related field
2 years working with cryogenic microwave signal delivery or equivalent
Experience with dilution fridges or other 4K systems capable of reaching temperatures needed for superconducting materials
Demonstrated communication ability by writing journal articles, thesis and giving live presentations
Demonstrated experience with mechanical electrical assemblies
Preferred
Simulation experience in HFSS or other microwave software
PhD in physics, electrical engineering or related field
4 years working in a superconducting electronics laboratory
Working with qubits and taking measurements such as T1, T2, and crosstalk
Mechanical design experience with complex assemblies and dealing with CTE mismatch
Company
IBM
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
10001+ employees
H1B Sponsorship
IBM has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)
Funding
Current Stage
Public CompanyTotal Funding
unknown2011-01-14IPO
Leadership Team
Alain Bénichou
Chief Executive Officer, IBM Greater China Group
Alex Yang
CTO and Chief Architect
Recent News
2026-01-25
2026-01-24
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