Summer 2026 Software Engineering Intern jobs in United States
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T-Mobile · 9 hours ago

Summer 2026 Software Engineering Intern

T-Mobile is synonymous with innovation, and they are seeking a highly motivated Software Engineering Intern for Summer 2026. This role offers hands-on experience working on real-world applications that support and enhance T-Mobile’s business solutions while collaborating with experienced software engineers.

InternetMobileTelecommunicationsWireless
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Responsibilities

Collaborate with software engineers to design, implement, test, and deploy complete software systems
Support the maintenance and enhancement of full-stack solutions, including front-end web frameworks, back-end services and APIs, microservices, databases, and cloud infrastructure
Maintain and support software solutions while learning the technical foundations of enterprise systems
Assist with deploying applications and partner with operations teams to support production environments
Contribute to event-driven architectures using technologies such as RabbitMQ and Apache Kafka
Participate in Agile/Scrum ceremonies and work closely with cross-functional teams
Learn and apply best practices related to DevOps, CI/CD pipelines, and cloud-native development

Qualification

Full-stack developmentCloud infrastructureAPIsMicroservicesAgile/ScrumEager to learnProblem-solvingCollaboration

Required

At least 18 years of age
Legally authorized to work in the United States
Must be actively enrolled in a Bachelors or Graduate degree program
Employees of T-Mobile or Metro by T-Mobile are ineligible for Internships

Benefits

Relocation assistance may be provided to program participants who reside more than 50 miles from the internship location.

Company

T-Mobile

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T-Mobile is a telecommunications company that provides wireless communication services, including mobile phone and internet services. It is a sub-organization of Deutsche Telekom.

Funding

Current Stage
Public Company
Total Funding
$17.37B
2026-01-05Post Ipo Debt· $2B
2025-10-06Post Ipo Debt· $2.8B
2024-09-23Post Ipo Debt· $2.5B

Leadership Team

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John Saw
President of Technology, Chief Technology Officer
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Peter Osvaldik
EVP & CFO
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Company data provided by crunchbase