NAND Memory Package R&D Engineer jobs in United States
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Solidigm · 3 hours ago

NAND Memory Package R&D Engineer

Solidigm is a multibillion-dollar global company specializing in memory technology, headquartered in Rancho Cordova, California. They are seeking an innovative NAND Memory Package Integration Engineer to support the development of packaging technologies for Solid State Drives (SSD) and ensure alignment with product roadmaps.

Data CenterData StorageHardware
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H1B Sponsor Likelynote

Responsibilities

Support the pathfinding and development of package technologies for Solid State Drive (SSD)
Pioneering packaging technologies to align with the SSD product roadmap
Work with the wafer fab and Assembly Test Subcon in process integration & development
Driving and tracking package design milestones
Integrating product requirements into packaging solutions
Identifying and resolving packaging design issues
Communicating design status

Qualification

Semiconductor package developmentSilicon thin film processingFailure analysisPackage substrate designHSPICEHigh-speed signal integrityPCB assemblyProgram managementPlanningPrioritizationAutoCADCadenceCommunicationTeamwork

Required

BS Physics, Chemistry, Chemical, Mechanical, Electrical or other Engineering discipline
5-10 years of experience in semiconductor package development
Knowledge in Silicon thin film processing and understanding of the interactions between silicon and Microelectronics package manufacturing
Familiar with Silicon layout design
Proficient in failure analysis at both silicon and package levels (EFA, PFA), design of experiments, and data analysis
Proven abilities in program management, communication, teamwork, planning, and prioritization

Preferred

Solid understanding of package substrate design from a signal integrity perspective
Proficient with HSPICE, Ansoft Q2D/Q3D, or other field solvers
Skilled in high-speed signal integrity, power delivery, and DDR package design
Familiar with PCB assembly and package-to-board interconnects
Knowledgeable about flip chip packaging
Experience with AutoCAD and Cadence (APD, Editor, SIP)

Company

Solidigm

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Solidigm provides storage products and solutions for data centers.

H1B Sponsorship

Solidigm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (66)
2024 (70)
2023 (58)
2022 (48)

Funding

Current Stage
Late Stage

Leadership Team

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Alan Bumgarner
Director of Strategic Planning
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Company data provided by crunchbase