Summer 2026 Software Engineering Internship jobs in United States
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T-Mobile · 6 hours ago

Summer 2026 Software Engineering Internship

T-Mobile is a leader in wireless innovation, and they are seeking a Software Engineering intern to contribute to their Device Insurance Technology group. The intern will gain hands-on experience in developing and optimizing microservices, while working closely with a Sr. Software Engineer on IT modernization projects.

InternetMobileTelecommunicationsWireless
badNo H1Bnote

Responsibilities

Learn and develop Spring Boot microservices for the Kyber Arch platform
Develop and execute unit tests
Participate in solving challenging problems either with products or development infrastructure

Qualification

Object Oriented ProgrammingSpring BootDatabases/SQLAWSAI ToolsMicroservicesAgile MethodologyProblem SolvingTeam Collaboration

Required

Enrolled in Computer Science/ MIS/IT or related majors
Hands-on experience in Object oriented programming and databases/SQL as part of course work or outside
At least 18 years of age
Legally authorized to work in the United States
High School Diploma or GED
Must be actively enrolled in a degree program or graduated with the last year
Employees of T-Mobile or Metro by T-Mobile are ineligible for Internship
Employers does not sponsor work visas for this position. Note that this also applies to individuals who are students of F-1 status who desire sponsorship after they complete their education

Preferred

Hands-on experience with using AI tools such as Claude code or similar, a plus
Experience with AWS/Azure, a plus

Benefits

Relocation reimbursement may be provided to program participants who reside more than 50 miles from the internship location.

Company

T-Mobile

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T-Mobile is a telecommunications company that provides wireless communication services, including mobile phone and internet services. It is a sub-organization of Deutsche Telekom.

Funding

Current Stage
Public Company
Total Funding
$17.37B
2026-01-05Post Ipo Debt· $2B
2025-10-06Post Ipo Debt· $2.8B
2024-09-23Post Ipo Debt· $2.5B

Leadership Team

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John Saw
President of Technology, Chief Technology Officer
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Peter Osvaldik
EVP & CFO
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Company data provided by crunchbase