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Google · 21 hours ago

Advanced Packaging Technologist

Sunnyvale, CA

Full-time

Onsite

Senior Level

$156K/yr - $229K/yr

5+ years exp

Google is a leading technology company that is shaping the future of AI/ML hardware acceleration. The Advanced Packaging Technologist will drive the development of advanced packaging solutions for ML chips, collaborating with multi-disciplinary teams to create high-performance packages optimized for electrical performance and reliability.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO

Growth Opportunities

H1B Sponsor Likely

Responsibilities

Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions

Drive the development of advanced test macro features and execute engineering plans for next-generation package architectures

Identify packaging risks and document technical assessments to guide the definition of critical test vehicles

Define and implement robust DFx (DFM, DFR, DFT) methodologies tailored specifically for advanced packaging technologies

Collaborate with internal teams, foundries, OSATs, and suppliers to deliver production-ready chip package solutions through execution of shared engineering plans

Qualification

Advanced packaging technologyPackage developmentSilicon photonics2.5D3D technologiesElectrical designThermal/mechanical performanceInnovationReliability standardsCollaboration

Required

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience

5 years of experience with package development for high volume production

5 years of experience with advance packaging technology development

Preferred

Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture

Experience with co-packaged copper (CPC), co-packaged optics (CPO), and silicon photonics

Experience in developing new technologies and driving innovation within the semiconductor packaging space

Experience working directly within wafer foundries or assembly houses (OSATs)

Knowledge of 2.5D and 3D failure modes and reliability standards

In-depth understanding of the interactions between packaging technology, electrical design, thermal/mechanical performance, and manufacturability

Benefits

Bonus

Equity

Benefits

Company

Google

Glassdoor4.4

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

Founded in 1998

Mountain View, California, USA

10001+ employees

https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (8763)

2024 (8872)

2023 (9682)

2022 (11626)

2021 (9109)

2020 (9785)

Funding

Current Stage

Public Company

Total Funding

$26.1M

Key Investors

Andy Bechtolsheim

2004-08-19IPO

1999-06-07Series Unknown· $25M

1998-11-01Angel· $1M

Leadership Team

Sundar Pichai

CEO

Thomas Kurian

CEO - Google Cloud

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