L3Harris Technologies · 8 hours ago
Scientist, Mechanical Engineering (Electronics Packaging)
Plano, TX
Full-time
Onsite
Senior Level, Lead/Staff
10+ years expL3Harris Technologies is dedicated to recruiting and developing high-performing talent in the defense industry. The company is seeking an Electronic Packaging Mechanical Engineer to work with a cross-functional team to develop, design, and implement radar systems, ensuring adherence to stringent technical and process requirements.
CommercialInformation TechnologyNational Security
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Proposal support and development
Assist with developing overall site wide Mechanical strategy
Work closely with cross-functional teams in the development of new solutions
Significant CAD modeling of parts & assemblies
Perform trade studies to determine optimal designs
Review Structural and thermal analysis of components & assemblies
Have deep understanding of thermal management of high-power electronics in constrained volumes
Electromechanical integration and electronics packaging
Lead mechanical design efforts
Lead peer reviews, PDRs, CDRs, and other required design reviews
Schedule, cost, and technical responsibility at the major subsystem level
Interface to customers & upper management
Provide guidance and mentorship for other team members formally or informally
Responsible for directing and reviewing the work of junior engineers and designers and technicians
Participate in risk assessment and develop mitigation strategies for complex projects
Ability to obtain and maintain any additional clearances as required
Proficiency in CAD tools such as Solidworks/Creo
Take on roles such as IPT Lead when necessary
Qualification
Required
Bachelor's Degree in engineering and minimum 12 years of prior relevant experience. Graduate Degree and a minimum of 10 years of prior related experience. In lieu of a degree, minimum of 16 years of prior related experience
Active Top Secret Security Clearance
Experience with standard ASME Y14.5M-1994 and GD&T
6+ years experience in 3D CAD modeling – PTC Creo, Catia, NX, or Solidworks
8+ years experience packaging electronics including design for and testing to military environments (i.e. temperature, vibration, shock, etc.)
8+ years experience with thermal management of high-power electronics
Experience leading in the generation of technical content for bids: scope capture, requirements development, materials pricing, and labor estimates as required
Preferred
Excellent people skills, with experience leading and collaborating in a multi-disciplinary, diverse, and dynamic team environment
Excellent communication skills (written, verbal, & presentation)
Strong hands-on capabilities, to include integration and diagnosis of complex mechanisms and products
Experience with EVMS cost and schedule practices
Benefits
Relocation assistance is available to qualified applicants
Company
L3Harris Technologies
L3Harris Technologies provides platform management system solutions for armed forces.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$2.25B2024-03-27Post Ipo Debt· $2.25B
1978-01-13IPO
Leadership Team
Tania Hanna
Vice President Government & Customer Relations
Chip Teets
Senior Director, International Programs, Products & Technology
Recent News
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