Systems Engineering Intern - Summer 2026 jobs in United States
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NXP Semiconductors · 9 hours ago

Systems Engineering Intern - Summer 2026

NXP Semiconductors is a leading company in the Security & Connectivity business unit, focusing on mobile and IoT solutions. They are seeking a Systems Engineering Intern to support i.MX processors, where the intern will manage a project from conception to execution, collaborating with global team members and contributing to firmware and demo development.

AppsAutomotiveEnergy EfficiencyInformation TechnologyManufacturingMobileNewsSemiconductorSoftwareVideo

Responsibilities

Build application / demos / drivers porting or development on innovative multimedia, connectivity, infotainment with the i.MX processor family
Build innovative functions or use case demonstrators in all applications fields: video, machine learning…
Perform technical feasibility studies on key functions
Build reference designs in various strategic domains, application notes and white papers writing
Review Reference Manuals and Data Sheets and contribute to Developer guides and 'Ease-of-use'

Qualification

C programmingEmbedded Systems on ChipLinuxTechnical writingARM Cortex architectureAndroidDevice driversOpenGL3D graphicsGStreamer

Required

Must be pursuing a Bachelor's degree in Computer Engineering, Electrical Engineering or Computer Science
Must have completed freshman level coursework or greater
Must have a strong level of proficiency in the C language

Preferred

Experience with embedded Systems on Chip, especially the ARM Cortex architecture
Embedded software development and debug experience including one of more of the following: Linux, Android, kernel modules and device drivers
Experience with embedded software development and debug
Familiarity with multimedia and graphics technologies is a plus (OpenGL, 3D graphics, video decode, GStreamer)
Technical writing skills for creating application notes, white papers, and user's guides / reference manuals

Company

NXP Semiconductors

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NXP Semiconductors produces secure connectivity solutions for embedded applications.

Funding

Current Stage
Public Company
Total Funding
$2.56B
Key Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO

Leadership Team

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Bill Betz
Chief Financial Officer
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Andy Micallef
EVP Global Operations
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Company data provided by crunchbase