Summer/Fall 2026 - Circuit Design Research Intern(7339) jobs in United States
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TSMC · 21 hours ago

Summer/Fall 2026 - Circuit Design Research Intern(7339)

TSMC, the world leader in semiconductor manufacturing, is seeking a Circuit Design Research Intern to join their Corporate Research Design Solution team. This internship offers a unique opportunity to engage in industrial R&D, collaborate with seasoned professionals, and contribute to advanced chip design solutions.

Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Pioneer Circuit Innovation: Conduct groundbreaking research and development, evaluating the Power, Performance, and Area (PPA) of novel circuit-level designs
Bring Ideas to Life: Play a crucial role in the proof-of-concept chip tapeout process, seeing your research transition from theory to a physical prototype
Collaborate & Grow: Work closely with a team of R&D experts, receiving mentorship and guidance as you navigate complex research problems
Share Your Discoveries: Actively participate in research group meetings, presenting your findings and engaging in stimulating discussions that push the boundaries of technology
Shape the Future: Contribute to the intellectual property landscape by converting your innovative work into patents and publications, leaving your mark on the industry

Qualification

Circuit Design PrinciplesChip Tapeout FlowMemory TechnologyAccelerator ArchitecturesTechnical Problem-SolvingProactivityCuriosityCollaborationCommunication Skills

Required

Current PhD student specializing in Electrical Engineering or a related field
Ready to commit to a 6-month internship, typically spanning from summer to fall
Possess a solid foundation in circuit design principles and hands-on experience with the chip tapeout flow
In-depth knowledge in at least one of the following critical areas: Memory Technology (SRAM, RRAM, MRAM, PCRAM), Memory Macro Design (Sense amplifiers, write circuitry, LDO, charge pumps, ADC/DAC), Accelerator Architectures (in-memory compute, near-memory computing, systolic arrays)
Demonstrated strong technical problem-solving and analytical skills
Self-driven, highly proactive, and genuinely enthusiastic about exploring and mastering new technologies
Strong team player with excellent written and spoken communication skills

Company

Established in 1987, TSMC is the world's first dedicated semiconductor foundry.

H1B Sponsorship

TSMC has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)

Funding

Current Stage
Public Company
Total Funding
$14.2B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B

Leadership Team

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Morris Chang
Founder, Chairman & CEO
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Peter M. Cleveland
Senior Vice President
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Company data provided by crunchbase