Lockheed Martin · 5 days ago
Senior Semiconductor Process Engineer
Possible
Full-time
Onsite
Mid, Senior Level
$93K/yr - $164K/yr
3+ years expLockheed Martin is a leader in aerospace and defense, seeking a Senior Focal Plane Array Process Engineer to join their Infrared Sensors Business in Goleta, CA. This role involves being the subject matter expert for the fabrication and execution of advanced Focal Plane Arrays, optimizing processes, and ensuring high-quality standards in a fast-paced production environment.
AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
No H1B
U.S. Citizen Only
Responsibilities
Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required. This may include defining requirements for new capabilities and organizing, leading, and executing FPA processing equipment capital procurement projects
Responsible for projects related to process definition, fabrication, modification and evaluation of FPA devices and components
Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions
Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols
Qualification
Required
Bachelors degree from an accredited college in Engineering, Physics, or related discipline
Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques
Must be a US Citizen, as this position is located at a facility that requires special access
Preferred
Bachelor's Degree with 3+ years of industry experience OR Master's Degree with 1+ year of industry experience, or PhD in Engineering, Physics, or related discipline
Background in IR FPA packaging, specifically flip-chip hybridization techniques
Knowledge of semiconductor device physics, photodetectors, and FPAs
Proficiency in MS Office (Word, PowerPoint, Excel)
Excellent engineering documentation skills and communication skills
Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff
Ability to multi-task, organize and prioritize assignments independently
Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP)
Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP
Benefits
Medical
Dental
Vision
Life Insurance
Short-Term Disability
Long-Term Disability
401(k) match
Flexible Spending Accounts
EAP
Education Assistance
Parental Leave
Paid time off
Holidays
Company
Lockheed Martin
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$6.06BKey Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M
Leadership Team
Jim Taiclet
Chairman, President & CEO
Craig Martell
Chief Technology Officer
Recent News
2026-01-24
2026-01-22
2026-01-17
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