Foxconn Interconnect Technology (FIT) · 2 hours ago
Senior Engineering Project Manager
Foxconn Interconnect Technology (FIT) is seeking a Senior Engineering Project Manager to lead the design, development, and delivery of next-generation wireless charging systems for the EV and consumer electronics markets. This role involves managing complex cross-functional development cycles and ensuring compliance with stringent performance requirements.
Responsibilities
Lead end-to-end project execution for wireless power systems—from concept architecture, detailed design, validation, to volume production
Own and drive technical specifications, FMEAs, DFMEAs, and design verification aligned with industry standards (e.g., SAE J2954, Qi, ISO 26262)
Guide multidisciplinary engineering teams across EE, ME, firmware, and test functions; support design reviews, technical issue resolution, and risk mitigation
Conduct or oversee thermal, EMI, power efficiency, and mechanical stress simulations to optimize design performance
Lead validation plans and hands-on testing (bench and field), perform root cause analysis, and implement design improvements
Act as a key technical contact for customers and internal stakeholders—ensuring alignment of product functionality, schedule, and cost targets
Provide leadership in documentation, regulatory compliance, and manufacturability (DFx) throughout the development cycle
Qualification
Required
PhD or Master's degree in Electrical, Mechanical, Systems, or Power Engineering
5+ years of experience in wireless charging, power electronics, or high-speed interconnect development in automotive, consumer electronics, or industrial sectors
Strong command of system-level design and technical problem-solving
Experience working with or developing for tier-1 or tier-2 suppliers
Familiarity with design for automotive-grade reliability, environmental testing, and global compliance standards (e.g., CE, UL, RoHS)
Strong communication skills, able to interface directly with global teams and customers
Willingness to travel (~25%) for site support, supplier audits, and customer engagement
Benefits
Competitive compensation
World class benefits
Incentive and recognition programs
Company
Foxconn Interconnect Technology (FIT)
FIT is an innovative market leader of connectivity technologies within the data center, mobile, computing, and IoT environments.
Funding
Current Stage
Late StageRecent News
IEEE Spectrum
2025-12-29
Business Standard India
2025-10-25
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