Apply on Employer Site

Qnity · 10 hours ago

Senior Engineer - Cu Hybrid Bonding

Marlborough, MA

Full-time

Hybrid

Mid, Senior Level

$99K/yr - $156K/yr

4+ years exp

Qnity is a global leader in materials and solutions for advanced electronics and high-tech industries, seeking a highly skilled and innovative engineer to lead their Copper Hybrid Bonding development program. The role focuses on advancing next-generation interconnect technologies for high-performance packaging and requires collaboration with various teams to develop and optimize bonding processes.

AerospaceAutomotiveConsumer ElectronicsHealth CareTelecommunications

Responsibilities

Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration

Define technical roadmap, milestones, and deliverables aligned with business objectives

Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes

Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB

Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality

Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology

Act as the primary technical interface with customers to align bonding technology with product requirements

Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering

Identify opportunities for process differentiation and file patents to protect intellectual property

Stay ahead of industry trends and benchmark against leading-edge CHB technologies

Qualification

Materials ScienceCopper BondingGrain EngineeringElectrochemical DepositionSemiconductor PackagingAnalytical SkillsProblem-Solving SkillsCommunication SkillsLeadership Abilities

Required

Master's degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred

Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred

Experience and knowledge in semiconductor packaging or interconnect technology development required

Proven expertise in grain engineering, copper bonding, and hybrid bonding processes

Hands-on experience with electrochemical deposition, CMP, and surface activation techniques

Strong analytical and problem-solving skills

Familiarity with reliability testing and failure analysis for bonded interfaces

Excellent communication and leadership abilities