Apple · 1 day ago
SIPI Architect for High-Speed SerDes
San Francisco, CA
Full-time
Onsite
Senior Level, Lead/Staff
$257K/yr - $386K/yr
20+ years expApple is a leading technology company, and they are seeking a SIPI Architect for High-Speed SerDes. In this high-impact role, you will define and own the signal and power integrity strategy for cutting-edge high-speed SerDes, ensuring robust interconnect performance from silicon to system.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Define and own the end-to-end SIPI (Signal and Power Integrity) architecture and strategy for cutting-edge high-speed SerDes links
Drive the technical direction and build consensus across cross-functional teams, including circuit design, packaging, system hardware, and validation, to deliver robust interconnect solutions
Lead system-level trade-off analysis to optimize interconnect performance, power, and cost across silicon, package, and system levels
Influence Apple's technology roadmap by providing expert guidance on future interconnect technologies, advanced packaging, and system-level co-design
Ensure robust interconnect design and performance by overseeing comprehensive modeling, simulation (statistical and time-domain), and silicon correlation
Develop and champion next-generation SIPI methodologies and best practices to guide design and analysis
Qualification
Required
Deep expertise in leading-edge SerDes technologies (224G+)
Modern interconnect protocols
System-level co-design
Preferred
MS or PhD in Electrical Engineering or a related field with 20+ years of relevant industry experience
Deep expertise in system-level SIPI for high-speed SerDes (112G/224G and beyond)
Proven experience architecting solutions for high-performance interconnects using standards such as Ethernet, PCIe, UAL and CXL
Expert in end-to-end channel modeling and link budget analysis, including statistical (e.g., COM) and time-domain simulation
In depth understanding of SerDes TX/RX equalization techniques, clocking and power delivery trade-offs
Experience leading cross-functional teams and driving technical consensus across silicon architecture, circuit design, packaging and system hardware groups
Experience designing interconnects for large-scale systems such as those in data center or high-performance computing (HPC) environments
Familiarity with emerging interconnect technologies, including co-packaged optics (CPO), and advanced packaging (e.g., 2.5D/3D integration)
Familiarity with system-level power integrity (PDN) and thermal co-design for large-scale, high-power ASICs
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase