R-10061087 Principal MEMS Design Engineer jobs in United States
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NXP Semiconductors · 16 hours ago

R-10061087 Principal MEMS Design Engineer

NXP Semiconductors is seeking a highly skilled Principal MEMS Design Engineer to join their sensor development team. This role focuses on the design and optimization of MEMS-based inertial sensors for Inertial Measurement Units (IMUs), leading innovative design efforts and collaborating with cross-functional teams for next-generation sensor solutions.

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Hiring Manager
Denise D.
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Responsibilities

Lead the design and development of MEMS inertial sensors for IMUs, including accelerometers and gyroscopes
Perform detailed simulation and analysis using tools such as ANSYS, COMSOL, and MATLAB/Simulink
Collaborate with process team to ensure design compatibility with MEMS fabrication processes and material constraints
Drive design reviews, provide technical guidance, and mentor junior engineers
Support prototype characterization, debugging, and performance optimization
Work closely with ASIC and system teams to ensure seamless integration and sensor-level architecture alignment

Qualification

MEMS designIMU developmentANSYSCOMSOLMATLAB/SimulinkMEMS fabricationCross-disciplinary collaborationProblem-solving

Required

MS or PhD in Electrical Engineering, Mechanical Engineering, Physics, or related field (PhD preferred)
10+ years of industrial experience in MEMS design and product development, with a focus on IMU (accelerometers and gyroscopes)
Proficiency in simulation and layout tools (e.g., COMSOL, ANSYS, MATLAB/Simulink, Cadence)
Strong understanding of MEMS fabrication processes, materials, and limitations
Excellent problem-solving skills and ability to work independently and in cross-disciplinary teams

Preferred

Knowledge of control systems and signal processing, with hands-on experience in prototype characterization
Familiarity with ASIC design integration and system-level sensor architecture

Company

NXP Semiconductors

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NXP Semiconductors produces secure connectivity solutions for embedded applications.

Funding

Current Stage
Public Company
Total Funding
$2.56B
Key Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO

Leadership Team

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Bill Betz
Chief Financial Officer
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Andy Micallef
EVP Global Operations
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Company data provided by crunchbase