Solidigm ยท 11 hours ago
Package Developer
California, United States
Full-time
Onsite
Senior Level
$171K/yr - $273K/yr
5+ years expSolidigm is a multibillion-dollar global company specializing in memory technologies, seeking an innovative Package Developer to support the development of package technologies for SSD and NAND flash storage applications. The role involves package design, integration of product requirements, and driving package design milestones while collaborating with internal and external teams.
Data CenterData StorageHardware
Responsibilities
Perform die fit analysis, stack-up, reference plane, and power distribution for multi-die NAND packages
Define device package pin-out and I/O bus interface
Integrate design requirements from high-speed electrical signaling, high-volume assembly design rules, package and/or PCB design rules, automated test, and emerging IC packaging techniques
Perform package and/or PCB routing study analysis for tradeoffs in cost and performance
Perform design, analysis, and validation of off-silicon platform interconnects, with a focus on memory interfaces such as DDR2 or on high-speed differential I/O interfaces such as SATA or PCIe
Define and develop electrical modeling capabilities and analysis techniques for busses and interconnects
Work with subcontractors in advancing packaging design rules for product roadmap intercept
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Material Science, or a related technical field
Experience: Minimum of 5 years of experience in package architecture, IC packaging, or PCB design engineering
Expertise with advanced packaging technologies, signal integrity simulation, and electrical analysis of high-speed interconnects (e.g., DDR2, SATA, PCIe, etc.)
Proven track record of successfully developing package design processes, including stack-up configuration, substrate design, die-fit analysis, and pin-out definition
Hands-on experience with signal integrity simulation tools such as HFSS, Sigrity, or CST Microwave Studio
Familiarity with packaging technology considerations such as die fit analysis, power distribution planning, routing tradeoff studies, and signal integrity concerns
Strong project management and communication skills to manage cross-functional teams across both internal teams and subcontractors
Ability to represent Solidigm in industry standard forums, collaborate effectively across multiple divisions, and integrate standards into product development
Preferred
Master's degree or PhD in Electrical Engineering, Mechanical Engineering, or Material Science
Experience: Over 8 years of in-depth technical expertise in IC packaging design or NAND product development
Knowledge of emerging packaging technologies and techniques (e.g., wafer-level packaging, 2.5D/3D IC integration)
Familiarity with JEDEC, ONFI, and other industry standards for memory and SSD packaging
Advanced proficiency in package modeling tools and techniques
Solid understanding of solder joint reliability failure modes and the factors influencing reliability (design, material quality, soldering techniques)
Solid understanding of package substrate design practices from a signal integrity and power integrity perspective
Knowledge of electrical analysis and design of high-speed buses (differential and single ended) as well as familiarity with simulation, modeling, and analysis tools
Understanding of thermal analysis and optimization related to multi-die NAND packages
Experience driving packaging technology innovation by partnering with subcontractors and suppliers
Ability to coordinate across multiple business divisions and contribute to the roadmap of SSD/NAND packaging technologies
Company
Solidigm
Solidigm provides storage products and solutions for data centers.
1001-5000 employees
H1B Sponsorship
Solidigm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (66)
2024 (70)
2023 (58)
2022 (48)
Funding
Current Stage
Late StageLeadership Team
Alan Bumgarner
Director of Strategic Planning
Recent News
2025-11-21
2025-11-19
Company data provided by crunchbase