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Northrop Grumman · 18 hours ago

Senior Principal Thermal Analysis Engineer - R10218956

Linthicum Heights, MD

Full-time

Onsite

Senior Level, Lead/Staff

$123K/yr - $185K/yr

6+ years exp

Northrop Grumman is a leading aerospace and defense company that offers employees the opportunity to work on revolutionary systems. They are seeking a Senior Principal Thermal Analysis Engineer to design advanced electronics thermal management solutions and lead thermal designs for various applications including airborne and naval systems.

AerospaceData IntegrationManufacturingRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Design advanced electronics thermal management solutions using heat transfer principles to optimize thermal performance

Perform electronics thermal analysis, requiring experience in heat transfer, including liquid cooled, air-cooled, two-phase flow, and refrigeration thermal solutions for Mission Systems platforms such as airborne, ground based, and naval applications

Lead thermal designs by owning thermal requirements, thermal architecture, and thermal performance of the design, while mentoring less experienced thermal engineers

Provide oral and written presentations to internal and external customers and stakeholders

Qualification

Thermal analysisHeat transfer principlesFinite volume softwareElectronics designThermal team leadershipANSYS IcepakANSYS FluentOral presentationsWritten presentations

Required

Bachelor's Degree with 8 years of experience, master's degree with 6 years of experience, Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics or related technical fields

U.S Citizenship is required

The ability to obtain/maintain a DoD Secret clearance

The ability to work onsite daily at the Linthicum, MD/Baltimore facility

Demonstrated experience in electronics design, with a focus on the thermal analysis and optimization of electronics systems

Minimum of 6 years of expertise in design by analysis with a finite volume or finite difference software package

Demonstrated application of thermal engineering principles to challenging convection and conduction problems

Minimum of 2 years of thermal team leadership including leading, mentoring, and reviewing work for small teams to achieve hardware design milestones

Preferred

A current active DoD Secret Clearance or higher

Advanced Degree in Mechanical or Aerospace Engineering with concentration in Heat Transfer and Fluid Dynamics

Minimum of 2 years of experience with one or more of the following software packages: ANSYS Icepak, ANSYS Thermal Desktop, ANSYS Fluent

2 or more years of experience leading the thermal design of hardware that meets challenging customer requirements

Demonstrated history of advising programs and projects of high level, multidisciplinary trade studies from concept through detailed design

2 or more years of experience designing hardware to meet transient thermal conditions, including energy storage and management

Experience advancing the state of the art for next generation electronics thermal design

Knowledge of advanced convective thermal management and design of single phase and two-phase thermal design for high heat flux/high power density applications using analytical, high fidelity, and experimental methods

Prior experience leading the thermal design of systems, CCAs, and microelectronics level thermal designs

Thermal design verification testing experience