GPD Optoelectronics Corp. ยท 1 month ago
Lead Electro-Optical Engineer (Packaging)
Salem, NH
Full-time
Onsite
Senior Level, Lead/Staff
8+ years expGPD Optoelectronics Corp. is seeking an accomplished technical lead engineer to join their team as a Lead Electro-Optical Packaging Engineer. This role involves overseeing the development of advanced packaging solutions for photodiode devices, ensuring product specifications are met while maintaining reliability and cost-effectiveness.
Electronic Design Automation (EDA)ElectronicsManufacturingTelecommunications
Responsibilities
Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture
Develop and document manufacturing techniques, materials, tools and processes related to backend Photodiode assembly
Performs analyses and selects techniques to solve problems and enhance product yield and process flows
Establish high yielding, cost effective processes based on product need and customer requirements
Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis
Evaluates and validates process and design alternatives based on product manufacturability
Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing
Provides processes that are robust and repeatable against product specifications and that support the quoted cost
Lead the manufacturing team in the direction for improving and streamlining existing processes for increased accuracy and efficiencies
Have a full understanding and uptodate knowledge of the NPI process as well as the requirements of our current (ISO9001)
Ensure that all projects assigned are fully auditable to the current site accreditations and work with quality manager to implement any suggested quality improvements
Drive meetings and coordinate actions to facility the team with achieving project budget and schedule requirements. Be the Technical Lead to the Business Unit with project plans and customer inquiries
Mentor junior staff
Other duties as assigned by your manager
Qualification
Required
BS in mechanical engineering or material science or closely related disciplines with at least 8 years of industrial experience in semiconductor or photonics area
Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wirebonding, flip chip die attach, and related qualification techniques
Demonstrated experience of working with engineering teams from different manufacturing disciplines
Strong manufacturing experience which insures high yield along with controlled process
Preferred
MSME with 6+ years of experience or equivalent experience in related discipline
4+ years technical leadership experience in crossfunctional teams
Experience designing electrical and pneumatic controls systems, specifying electrical and pneumatic control components, and designing the mechanical layout of an electromechanical and/or pneumatic controls system
Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc
General awareness of FEAbased analysis techniques as related to photonics and PIC package designs would be distinct advantage
Able to lift up to 20lbs
Travel may be required
Company
GPD Optoelectronics Corp.
At GPD Optoelectronics, we're committed to upholding the highest standards of integrity and trust, which fuels our ongoing pursuit of excellence and fosters strong, lasting relationships with both our team members and customers.
51-200 employees
Funding
Current Stage
Growth StageLeadership Team
David Beatson
Chief Executive Officer
Don Belanger
Controller -report to Board Director, CEO.
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