TSMC · 13 hours ago
BIM Engineer
Phoenix, AZ
Full-time
Onsite
Entry Level
1+ years expTSMC is a leading semiconductor manufacturer based in Arizona, seeking a BIM Engineer to design and optimize semiconductor FAB projects. The role involves utilizing advanced BIM tools to create 3D models, manage tool layouts, and ensure project compliance across global expansions.
Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
Responsibilities
Utilize advanced BIM software tools such as Revit, AutoCAD, Navisworks, and Bluebeam to develop accurate 3D models, manage spatial layouts for new FAB tool design, and manage space allocation for tools
Conduct field observations to assess construction readiness and verify on-site conditions against 3D federated model
Assign facility ports to semiconductor tools and ensure tool requirements align with project specifications
Coordinate effectively between various tool engineering modules, Facility engineers, (ISEP (Integrated Systems Engineering and Planning), IT, and AMHS (Automated Material Handling Systems)
Continuously evaluate and refine design workflows to improve efficiency, reduce design cycle times, and maintain high quality of QAQC
Participate and support projects across FAB facilities in Taiwan, Japan, Europe, and any future TSMC global FAB expansions ensuring compliance with regional standards and cultural considerations
Track project progress, identify potential issues, and escalate concerns to the team leader or section manager as needed
Identify and mitigate risks within the project domain to ensure timely and successful outcomes
Use tools like Navisworks to perform clash detection and coordinate resolutions across disciplines, ensuring error-free construction documentation
Maintain accurate and detailed design documentation, adhering to project standards and best practices
Qualification
Required
Bachelor's degree in Science, Civil Engineering, Mechanical Engineering, or a related field is required
Minimum of 1-3 years of modeling experience, or at least 1 year in semiconductor construction
Proficiency in auto-programming and Building Information Modeling (BIM) software including Autodesk Revit, AutoCAD, Navisworks, and Bluebeam
Hands-on experience collaborating with engineers, construction teams, and stakeholders during the design and build phases
Must be willing and able to travel internationally as required to support global projects
Strong problem-solving skills, active learning attitude, and positive approach
Strong interpersonal and communication skills to facilitate collaboration across multidisciplinary teams
Preferred
Master's degree in Architecture, Civil Engineering, Software engineering or Construction Management
Advanced skills in parametric modeling, clash detection, and project visualization using tools like Navisworks Manage, Dynamo for Revit, or other BIM plug-ins
Prior experience in semiconductor FAB design, high-tech facility development, or cleanroom environments
Ability to improve and optimize design workflows, including automation and process standardization across multiple projects and regions
Knowledge with building codes, standards, and best practices including international
Ability to communicate in Mandarin, German, and Japanese languages is a plus
Benefits
Medical, Dental, and Vision Plans: Choose the options that best fit your and your family’s needs.
Income-Protection Programs: Financial assistance during injury or illness.
401(k) Retirement Savings Plan: Secure your financial future with competitive employer contributions.
Paid Time-Off Programs and Holidays: Recharge and spend quality time with loved ones.
Company
TSMC
Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
10001+ employees
H1B Sponsorship
TSMC has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)
Funding
Current Stage
Public CompanyTotal Funding
$14.2BKey Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B
Leadership Team
Morris Chang
Founder, Chairman & CEO
Peter M. Cleveland
Senior Vice President
Recent News
2026-01-13
Channel NewsAsia
2026-01-12
2026-01-12
Company data provided by crunchbase