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Viasat · 6 hours ago

RF/Microelectronics Packaging Engineer

Tempe, AZ

Full-time

Onsite

Senior Level, Lead/Staff

$154K/yr - $278K/yr

10+ years exp

Viasat is a global communications company on a mission to deliver connections that change the world. The RF/Microelectronics Packaging Engineer will handle all aspects of packaging development for radio frequency communication devices, including planning, crafting, and developing advanced packaging solutions.

InternetOptical CommunicationTelecommunications

No H1B

U.S. Citizen Only

Responsibilities

Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/sophisticated/novel packaging solution for RF communication products

Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost

Ensure all packaging work is completed for New Product and New Technology Introductions

Develop and manage packaging documentation including SOWs, package drawings, and process flows

Build and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers

Ensure early success in package development with modeling and simulation for thermal, mechanical, and electrical

Technically oversee vendors in the manufacture of said packages in conjunction with manufacturing engineers

Apply your assembly knowledge of die attach, Wirebond, bumping, overmolding to advise product groups on options available to solve problems

Identify suitable IC, sub-assembly, and module package options and perform feasibility studies for new products

Interact with product groups for package/cost optimization along with mechanical engineering

Specify and conduct reliability testing by vendors to insure the reliability of the packaged product

Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories)

Address and solve materials and processing issues that may occur during the development process

Manage the package process using industry standard project management tools

Develop and maintain the packaging and technology roadmap through proposal support and long term technology programs

Qualification

Semiconductor packagingMicro-electronic package structureRFIC packaging knowledgePackage design experienceHeat transfer understandingDie attach knowledgeStatistical methodsProject management toolsCadence APD/SiPSolidWorksMicrosoft ExcelCustomer service orientationInterpersonal skills

Required

10+ years in semiconductor packaging including experience in package assembly process, package engineering, quality & reliability and the intersection/relationship of packaging to test

Deep understanding of micro-electronic package structure, mechanical, electrical and thermal performance

Solid grasp of heat transfer and its relation to material properties

Packaging knowledge in RFIC, millimeterware, System In Package, sub-assembly, and/or modules

Experience in semiconductor package design with demonstrated experience in one or more of the following: QFN, SiP, BGA, WL-CSP, Flip Chip and Bumping or FO-WLP

Strong understanding of Die Prep, Assembly (die attach, Wirebond, flip chip, etc) and Surface Mount Technology (SMT) process-equipment is desired

Have a high tolerance for ambiguity and solid interpersonal skills

In-depth knowledge of interconnect reliability daisy chain testing, CPI and BLR

Understands the metallization schemes for laminates, interposers and SMT

Knowledge of statistical methods and Building of Experiments

Must be able to work autonomously and help determine methods and procedures

Customer service oriented

Ability to work with build teams to translate IC/system requirements input packaging configurations

Ability to manage and drive packaging

Bachelor's Degree in Electrical, Mechanical, Materials Engineering or related technical discipline

US Government position. US Citizenship required

Ability to travel up to 10%