R&D Hardware Mechanical Design Engineer Summer Intern jobs in United States
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Keysight Technologies · 5 hours ago

R&D Hardware Mechanical Design Engineer Summer Intern

Keysight Technologies is a leader in technology innovation, focusing on electronic design and testing solutions. The R&D Mechanical Engineer Intern will contribute to the design of mm-wave front-end products, applying mechanical engineering skills to various phases of the design process.

AnalyticsCloud SecurityElectronicsManufacturingNetwork SecurityProduct DesignSoftwareTest and MeasurementWireless
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Responsibilities

Develop thermal and mechanical models to solve challenging electronics packaging issues
Work within a multi-discipline project team to investigate and evaluate new electronics packaging technologies
Document new designs and assemblies

Qualification

3D CADThermal analysisStress analysisMechanical engineeringEngineering fundamentalsMechanical fabrication processesCommunicationSelf-starter

Required

Working towards a degree in Mechanical Engineering or related field at an accredited university
Experience with 3D CAD (preferably Siemens NX)
Experience/interest with mechanical thermal and stress FEA analysis tools
A self-starter with the ability to generate new ideas, navigate a dynamic environment and deliver results
Strong foundation of engineering fundamentals
Excellent written and verbal skills and ability to work across multiple disciplines
Candidates must be enrolled in an accredited college/university as of September 2026
Applicants who have graduated before September 2026 will not be considered unless they are entering/applying to a MS or PHD program after graduating
Visa Sponsorship is not available for this position

Preferred

A strong interest in the mechanical design of electronics packaging and interconnect
An understanding of various mechanical fabrication processes (machining, die casting, plastic molding, sheet metal) and engineering materials

Company

Keysight Technologies

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Keysight Technologies is an electronic measurement company.

Funding

Current Stage
Public Company
Total Funding
$1.35B
Key Investors
Department for Science, Innovation and Technology (DSIT)
2025-04-10Post Ipo Debt· $750M
2024-10-02Post Ipo Debt· $600M
2023-09-15Grant

Leadership Team

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Satish Dhanasekaran
President and Chief Executive Officer
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Brad Doerr
Vice President and General Manager
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Company data provided by crunchbase