Intel Corporation · 1 day ago
TD Media and Collaterals Development Engineer
Phoenix, AZ
Full-time
Onsite
New Grad, Entry Level
$115K/yr - $162K/yr
0+ years expIntel Corporation is a leader in semiconductor manufacturing, aiming to deliver cutting-edge technology for the AI era. The TD Media and Collaterals Development Engineer will develop media and collaterals for assembly processes, optimize manufacturing efficiency, and ensure quality and reliability in packaging technology.
Semiconductors
Responsibilities
Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies
Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements
Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers
Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability
Performs and influences media and collateral design, material selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms
Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur
Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones
Qualification
Required
Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field
Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
Preferred
Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
Portfolio of self-completed project examples from concept to fabrication
Assembly equipment, process, media, and/or collateral experience
Technical innovation and deliver results for complex, time critical technical projects
Understanding of semiconductor fabrication processes and technology with technical and analytical skills
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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