Staff Memory Design Engineer, HBM jobs in United States
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Micron Technology · 5 days ago

Staff Memory Design Engineer, HBM

Micron Technology is a world leader in innovating memory and storage solutions. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while collaborating globally across various teams to ensure manufacturable, high-quality, cost-optimized solutions.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution
Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership
Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts
Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits
Prepare and maintain design documentation while contributing to best‑known practices and departmental training
Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality
Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues
Prepare project status reports and lead design reviews to communicate progress and technical decisions

Qualification

CMOS Circuit DesignDRAM subsystem architectureCadence VirtuosoFINESIMHSPICEVERILOGAnalytical skillsProblem-solving skillsCommunication skillsInterpersonal skills

Required

Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning
Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG
Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation
Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience
Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market

Preferred

Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions
Deep knowledge of industry‑specific technologies and competitive trends
Excellent communication and interpersonal skills for cross‑functional collaboration
BS or MS in Electrical Engineering or related field plus 6 years of experience in DRAM design, product, or system

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase