Georgia Institute of Technology · 1 day ago
Postdoctoral Fellow
Atlanta Metro
Full-time
Onsite
Senior LevelGeorgia Tech is a top-ranked public research university situated in Atlanta, known for its commitment to diversity and innovation. The Postdoctoral Fellow will contribute to groundbreaking research in semiconductor technologies, particularly in glass-core packaging and 3D heterogeneous integration, while collaborating with academic institutions and industry partners.
EducationHigher EducationUniversities
Responsibilities
Mentoring Students: Collaborate with and mentor graduate and undergraduate students in both research and development activities, enhancing their learning and fostering their growth in advanced packaging technologies
Industry & Academic Collaboration: Work closely with academic institutions, industry partners, and external collaborators to ensure research is relevant and applicable to real-world applications
Research Documentation and Reporting: Maintain comprehensive records of research, including experimental data, design changes, and results. Provide clear, concise reports to sponsors and stakeholders according to a strict set of timelines
Sponsor Reporting: Provide timely and thorough updates to project sponsors, ensuring alignment with contractual expectations and deliverables. This includes presenting to sponsors and technical community on findings
Cross-Disciplinary Teamwork: Work in close coordination with other researchers, engineers, and external partners to drive innovation and progress in your respective focus areas
Scholarly Publications: Advance foundational science and publish scholarly articles
Glass-Core Micro structuring: Develop and implement new techniques for micro structuring glass cores for advanced packaging applications
Multilayer High-Density Interconnect Fabrication: Design, fabricate, and characterize high-density interconnects for glass-core packaging
Thermo-Mechanical Modeling and Experimental Validation: Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures
Computational Mechanics: Develop multi-scale and multi-physics numerical models consisting of metal, polymer, ceramic, and other electronic packaging materials, and offer insight into interlayer delamination, cracking, and warpage under monotonic and fatigue loading conditions
Characterization and Reliability Assessment: Characterize materials, interfaces, and samples for thermo-mechanical properties, determine process-induced defects, perform application-relevant reliability experiments, and conduct failure analyses
Compound Semiconductor and Si Stacking, Fabrication, and mechanical Characterization: Design and fabricate TSVs for 3D integration, understand compound semiconductor stacking, and conduct mechanical characterization to validate performance
Advanced Bonding and Assembly Technologies for 3D Chip Stacks: Develop and apply novel bonding and assembly methods for 3D chip stacking, enhancing performance and reliability
Qualification
Required
A doctoral degree in Engineering or related fields
Preferred
A PhD in Mechanical Engineering or Materials Science and Engineering or a closely related field
The ability to mentor students at the undergraduate and graduate level, while also collaborating with academic and industry partners
Excellent documentation and reporting skills
Excellent written and verbal communication skills, including the ability to prepare technical reports and presentations
Company
Georgia Institute of Technology
Georgia Institute of Technology operates as a state-funded research university.
Founded in 1885
5001-10000 employees
H1B Sponsorship
Georgia Institute of Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (163)
2024 (189)
2023 (130)
2022 (101)
2021 (40)
2020 (51)
Funding
Current Stage
Late StageTotal Funding
$21.95MKey Investors
US Department of EnergyARPA-ENational Institute on Drug Abuse (NIDA)
2024-07-31Grant· $1.97M
2023-11-22Grant
2023-04-26Grant· $6M
Leadership Team
Raghupathy Sivakumar
Vice President of Commercialization & Chief Commercialization Officer
Ashok Goel
Professor
Recent News
2025-11-03
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