Sandisk · 1 day ago
Principal Engineer, Packaging Engineering
Milpitas, CA
Full-time
Onsite
Senior Level, Lead/Staff
$126K/yr - $179K/yr
5+ years expSandisk is a leading company in computer hardware, known for its innovative solutions in Flash and advanced memory technologies. The Principal Engineer in Packaging Engineering will be responsible for thermal designs and modeling for semiconductor packaging and PCBA, focusing on solutions for small form factor packages in constrained environments.
Data StorageManufacturingSemiconductor
Responsibilities
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments
Qualification
Required
Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience
Solid knowledge through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas
A strong background in thermal sciences with emphasis on both analytical and measurement methods
Thorough knowledge of material thermal properties and test methods
Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as FloTHERM and ANSYS Icepak
Working knowledge in scientific programming
Demonstrated strong work ethic
Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development
Strong oral and written communication skills
Demonstrated strong work ethic
Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development
Benefits
Paid vacation time
Paid sick leave
Medical/dental/vision insurance
Life, accident and disability insurance
Tax-advantaged flexible spending and health savings accounts
Employee assistance program
Other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
Tuition reimbursement
Transit
The Applause Program
Employee stock purchase plan
The Sandisk's Savings 401(k) Plan
Company
Sandisk
SanDisk designs, develops, manufactures, and markets data storage solutions in the United States and internationally.
5001-10000 employees
H1B Sponsorship
Sandisk has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (210)
Funding
Current Stage
Public CompanyTotal Funding
$713.58M2025-06-06Post Ipo Secondary· $713.58M
2015-10-21Acquired
1995-11-17IPO
Leadership Team
N
Netanel Nutman
Senior Manager , Software/Protocol Testing
Recent News
2026-01-07
The Motley Fool
2026-01-07
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