Qualcomm · 14 hours ago
Signal Integrity Architect
Santa Clara, California, United States of America
Full-time
Onsite
Senior Level
$220K/yr - $330K/yr
6+ years expQualcomm Technologies, Inc. is dedicated to transforming the industry by developing next-generation computing platforms. The Signal Integrity Architect will develop high-performance signal integrity solutions for advanced server applications, collaborating with cross-functional teams and leading the definition and verification of signal integrity for high-speed interconnects.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Collaborate with SoC, applications engineering, packaging, and system design teams to define and implement system interconnects that meet the unique demands of high-end server environments
Provide guidelines and feedback on silicon timing, bump/RDL, package pinout and PCB specifications
Develop customer guidelines and define module interfaces/formats for simulation
Lead the creation of server-grade SI models, simulations, and final designs
Perform early SI analysis on 2.5D/3D structures and establish design guidelines
Update and automate design and analysis flows
Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers
Qualification
Required
Master's degree in Electrical or Computer Engineering, with a specialization in Signal Integrity (SI)
6+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems
Strong knowledge of SI fundamentals, including power distribution networks (PDN), EMIR, transmission line theory, crosstalk, S-parameters, and channel simulations
Expertise in DDR5/LPDDR5X JEDEC specifications and/or SerDes standards (PCIe, CXL, USB, Ethernet, etc.)
Experience in developing SI methodologies from die to system, with lab correlation and validation
Proficiency with 2D/2.5D/3D EM simulation tools such as ANSYS HFSS Cadence Sigrity, Dassault Systèmes CST, Keysight ADS, and Synopsys' HSPICE
Hands-on experience creating complex SI models and performing both frequency and time-domain simulations
Proficiency in Unix/Linux environments and experience with EDA tools through scripting
Strong knowledge of packaging and PCB technologies, design, and manufacturing processes
Familiarity with 2.5D/3D packaging technologies, such as CoWoS, InFo, EMIB, and RDL
Hands-on experience with electrical validation and compliance testing using tools like VNAs, oscilloscopes, spectrum analyzers, PCIe/I2C analyzers, traffic generators, TDR, and differential probes
Proven ability to work independently and collaboratively within a cross-functional team environment
Strong technical documentation skills and excellent written and verbal communication
Preferred
Ph.D. in Electrical or Computer Engineering, specializing in SI
10+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems
In-depth understanding of computational electromagnetics and transmission line theory
Proficiency in DDR5 and LPDDR5X timing budgets, jitter analysis, and PHY design/link analysis
Experience with SI simulation for PCIe Gen6+, multi-gigabit serial buses (112Gbps+), UCIE, etc
Experience with package and PCB design tools such as Cadence Allegro
Proficiency in scripting with MATLAB, Perl, and Python
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (1752)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
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