The University of Texas at Austin · 2 weeks ago
Thermal Mechanical Modeling Engineer
The University of Texas at Austin's Texas Institute for Electronics is seeking a Thermal Mechanical Modeling Engineer to lead and execute thermal and mechanical simulations for advanced semiconductor packaging. The role involves collaborating with EDA vendors and guiding technical strategy while mentoring junior engineers.
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Responsibilities
Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages
Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates
Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design
Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains
Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows
Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams
Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies
Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums
Other related functions as assigned
Qualification
Required
BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline
3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms
Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio
Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows
Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows
You're energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen
Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management
Location. Austin, Texas is required for close collaboration with our engineering teams and partners
MS or PhD in Electrical Engineering, Applied Physics, or related discipline
5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms
Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.)
Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages
Preferred
Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups
Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards
Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains
Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement
Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Company
The University of Texas at Austin
The University of Texas at Austin is one of the largest public universities in the United States.
Funding
Current Stage
Late StageTotal Funding
unknownKey Investors
Republic Capital Group
2022-09-14Series Unknown
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