Sr Staff or Principal Thermal Engineer, Server Packaging jobs in United States
cer-icon
Apply on Employer Site
company-logo

Qualcomm · 2 weeks ago

Sr Staff or Principal Thermal Engineer, Server Packaging

positionSan Diego, CA
timeFull-time
remoteOnsite
senioritySenior Level, Lead/Staff
money$180K/yr - $271K/yr
date10+ years exp

Qualcomm Technologies, Inc. is developing high performance, energy efficient server solutions for data center applications. The role involves developing thermal solutions for server products, leading thermal architecture solutions, and conducting thermal simulations and tests.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Lead thermal architecture solutions through simulation and test while working with various stakeholders
Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase
Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations
Develop custom SW solutions to automate thermal modeling and test
Conduct thermal tests to validate/characterize models and present results to stakeholders
Analyze and document simulation and test results

Qualification

Thermal management designCFD simulationsProgramming PythonProgramming C/C++Programming MATLAB3D packaging experienceANSYS-Icepak proficiencyThermal testingSolidworksCreoAI/ML conceptsPresentation skillsCommunication skills

Required

MS in Mechanical Engineering
10+ years of industry experience in electronics cooling related to server products
Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan
Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development
Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC
Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment
Excellent presentation, negotiation, and communication skills
Ability to clearly communicate complex technical content in written and verbal formats

Preferred

PhD in Mechanical Engineering
Industry exposure to 2.5/3D packaging is highly desirable
Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable
Some experience with AI/ML concepts, algorithms, and methodologies is a plus

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

twittertwittertwitter
Glassdoor4.0
company-logo
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
dateFounded in 1985
location
San Diego, California, USA
people-size10001+ employees
web-link
http://www.qualcomm.com

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

leader-logo
Cristiano Amon
President and Chief Executive Officer
linkedin
I
Isaac Eteminan
CEO
linkedin

Recent News

Android Authority
Your Android-powered car will get faster updates thanks to Qualcomm
2026-01-09
eeNews Europe
Meta and Qualcomm push RISC-V market share towards 25%
2026-01-09
PYMNTS.com
Edge AI Is Gaining on the Cloud
2026-01-08
Company data provided by crunchbase