Multimedia Engineering Internship – Summer 2026 jobs in United States
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Qualcomm · 3 weeks ago

Multimedia Engineering Internship – Summer 2026

Qualcomm is a leading technology company focused on innovating and transforming businesses through intelligent computing. The Multimedia Engineering Intern will work on advanced technologies related to multimedia systems, contributing to the design and optimization of Snapdragon devices.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
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Comp. & Benefits
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H1B Sponsor Likelynote

Qualification

CC++PythonMachine LearningComputer VisionSignal ProcessingCollaborationCreativityContinuous Learning

Required

Currently enrolled in a bachelor's, master's, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as C, C++, Python

Preferred

Currently enrolled in a Master's or PhD degree program in computer engineering, computer science, electrical engineering, or a related field
Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Graphics: OpenCL, compilers, ray tracing, GPU, Vulkan/DX
Computer Vision/XR: DNNs, motion, AR/XR, depth, linear algebra, perception
Imaging: Image/video segmentation, 3D, pattern recognition, image/video processing
Speech/Audio: Acoustics, TTS/text-to-speech, speech/audio signal processing and compression
Video: Digital signal processing, compression
Software Apps/Tools: Linear algebra, AR, perception, Oculus Air
Experience with machine learning frameworks (TensorFlow, PyTorch), deep learning, neural networks
Strong understanding of signal processing
Ability to program effectively in C/C++, Python, and/or Matlab

Benefits

Competitive hourly pay
Accrued vacation time
Relocation coverage
Furnished housing accommodations
Annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

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Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

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Cristiano Amon
President and Chief Executive Officer
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Isaac Eteminan
CEO
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Company data provided by crunchbase