CMP Process Development Engineer jobs in United States
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Texas Instruments · 2 hours ago

CMP Process Development Engineer

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. The CMP Process Development Engineer will be responsible for the development, characterization, and optimization of embedded processors to meet volume production requirements as part of the Advanced Technology Development team.

ComputerDSPSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
Work with multiple process, integration, reliability, packaging and test engineers to achieve these goals
Work closely with the product groups to identify and optimize the embedded processor performance to meet critical final device parameters to enable game changing products in the market
Compile and evaluate test data to determine appropriate limits and variables for process or material specifications
Conceive and plan projects involving definition and selection of new concepts, equipment, chemistry, automation, or approaches in the development of new processes
Provide technical engineering support in the manufacturing area
Recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques, fundamental capabilities and production yields for existing products
Partners with vendors to define and execute on equipment and process development roadmaps

Qualification

CMP processes28nm node semiconductorDevice physicsHKMG CMP300mm CMP platformsWLEP systemsOrganic film CMPAnalytical skillsCommunication skillsProblem-solving skillsTeam collaborationTime management

Required

Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree
5 years of experience working on CMP processes
28nm node semiconductor process experience

Preferred

PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree
Strongly prefer experience with HKMG CMP, TiN CMP, Poly CMP, CuCMP, and/or NVM like ReRAM/CBRAM/FRAM
Excellent understanding of WLEP systems and demonstrated experience of building white light based endpoints
Demonstrated experience with organic film CMP such as resist and/or BARC
Working knowledge of advanced CMOS device physics and reliability mechanisms in advanced logic and CMOS technologies
Experience across multiple 300mm CMP platforms
Experience driving vendor engagement to leverage best in class tool and chemistry needs
Previous direct R&D experience in 300mm semiconductors
Device physics training with understanding of materials and electrical test characterization
Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
Strong verbal and written communication skills
Ability to quickly ramp on new systems and processes
Demonstrated strong interpersonal, analytical and problem-solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery

Benefits

Competitive pay and benefits designed to help you and your family live your best life

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.

H1B Sponsorship

Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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Company data provided by crunchbase